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MIRTEC MV-6e Inline AOI Machine for PCB Assembly

MIRTEC MV-6e Inline AOI Machine for PCB Assembly

Evaluate the MIRTEC MV-6e for component and solder-joint inspection, with camera, side-view and laser options clearly specified for the machine offered.

Jank’aki Mayt’aña Email:smt-sales9@gdxinling.cn
Qhananchanaka

Reflective component surfaces and solder joints place different demands on an inspection system. The MIRTEC MV-6e combines telecentric camera optics with multi-phase colour lighting, providing different illumination conditions for evaluating assembled boards.

Top-down inspection covers component presence, alignment, polarity and visible solder conditions. Depending on configuration, side-view cameras add angled images, while INTELLI-SCAN laser inspection provides height and coplanarity checks for specified devices.

The MV-6e’s laser-based capability differs from the Moiré-based inspection of the MV-6e OMNI. We identify the installed camera, lighting and measurement hardware in the equipment specification, so the inspection scope is clear before purchase.

MIRTEC MV-6e Core Technical Specifications

Parámetro ukaxaEspecificación ukax mä juk’a pachanakanwa
MuriluMV-6e
Equipment TypeInline AOI with configuration-dependent laser 3D inspection
Standard PCB Inspection Area50 × 50 to 510 × 460 mm
Top-Down Camera Options10 MP Camera Link / 18 MP CoaXPress
Pixel Resolution — 10 MP13.4 or 9.8 μm per pixel
Pixel Resolution — 18 MP9.8 or 7.3 μm per pixel
Side-View Camera OptionsFour 10 MP or 18 MP cameras
Height Inspection SystemINTELLI-SCAN laser, where installed
Lighting SystemEight-phase colour LED
Lens TypePrecision telecentric compound lens

MIRTEC smt 2D AOI machine MV-6e

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Uñt’ayañataki:No 18, Shangliao Industrial thakhi, Shajing markan, Distrito Baoan, Shenzhen, China markan

Consulta ukax teléfono ukan jakhupawa:+86 13823218491

Correo electrónico:smt-aljasiñanaka9@gdxinling.cn ukan uñt’ayata

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