en
ori
alb
amh
ara
arm
aym
aze
bel
ben
bos
bul
bur
cs
dan
de
div
el
est
fil
fin
fra
gle
glg
grn
heb
hi
hkm
hrv
hu
ice
id
it
jp
kan
kin
kor
lao
lav
lit
ltz
lug
mao
may
mlt
nep
nl
nor
nya
orm
per
pl
pt
rom
ru
san
sk
som
spa
srp
swa
swe
tam
th
tr
ukr
urd
vie
wel
xho
The MIRTEC MV-6e OMNI brings three-dimensional measurement to PCB assembly inspection, adding component height and shape information to conventional image-based checks. This helps distinguish placement defects that can be difficult to judge from colour and contrast alone.
Missing components, shifted packages and lifted or tilted parts require different inspection criteria. By evaluating the assembly in three dimensions, the MV-6e OMNI gives production teams more information when reviewing a suspected defect and deciding whether a board needs rework.
For factories moving from 2D AOI, the main benefit is the additional measurement information available at the inspection station. Camera resolution, optical configuration and software functions vary between machine generations, so we identify the offered configuration separately rather than applying specifications from the newer MV-6 OMNI to an older MV-6e OMNI.
MIRTEC MV-6e OMNI 3D AOI Specifications
| פָּרִיט | פרטים |
|---|---|
| דֶגֶם | MV-6e OMNI |
| Equipment category | 3D automated optical inspection |
| Inspection object | Assembled PCBs |
| Measurement focus | Component position, height and shape |
| Camera and optical configuration | Confirm against the offered machine |
