Omulimu omukulu ogw’ekyuma kya BESI ekya AMS-LM kwe kukwata substrates ennene n’okuwa ebibala eby’amaanyi n’okukola obulungi n’amakungula. Ekyuma kino kisobola okukwata substrates za mm 102 x 280 era nga kirungi ku package zonna eziriko oludda olumu n’oludda olubiri eziriwo kati.
Ebifaananyi n’ebivaamu
Okukwata substrates ennene: AMS-LM series esobola okukwata substrates ennene, okutuukiriza ebyetaago by’okukola ebyuma eby’omulembe ku substrates ennene.
Ebivaamu eby’amaanyi: Okuyita mu nkola ennungi ey’okubumba, ekyuma kisobola okulongoosa ennyo enkola y’okufulumya n’okukakasa nti kivaamu omutindo ogwa waggulu.
Enkola n’amakungula: Okukozesa ebikozesebwa ebinene n’ebibala ebingi awamu bikakasa okukola obulungi n’amakungula amangi
Enkola ya BESI AMS-LM TopFoil chip molding system erina omulimu gwa TopFoil ogusobozesa okukola ebintu bya bare chip awatali kujjula. TopFoil special foil elungamizibwa waggulu w’ekibumbe okukola omutto omugonvu oguziyiza chip okubikkibwako compound, ekimalawo obwetaavu bw’okukola omutendera omulala ogw’okuyonja
