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EKHAYA>imveliso > Izixhobo zeSemiconductor > umatshini wokubumba >
Fico Molding line AMS-LM

Fico Molding umgca AMS-LM

Umsebenzi ophambili womatshini we-BESI we-AMS-LM kukucubungula ama-substrates amakhulu kunye nokubonelela ngemveliso ephezulu kunye nokusebenza kakuhle kunye nemveliso. Umatshini uyakwazi ukusetyenzwa 102 x 280 mm substrates a

Isicelo esiKhawulezayo Email:smt-sales6@gdxinling.cn
Iinkcukacha

Umsebenzi ophambili womatshini we-BESI we-AMS-LM kukuphatha ama-substrates amakhulu kunye nokubonelela ngemveliso ephezulu kunye nokusebenza kakuhle kunye nesivuno. Umatshini unokusingatha i-substrates ye-102 x 280 mm kwaye ifanelekile kuzo zonke iipakethi zangoku ezisecaleni kunye namacala amabini.

Iimpawu kunye neziphumo

Ukuphatha ama-substrates amakhulu: Uluhlu lwe-AMS-LM luyakwazi ukuphatha ama-substrates amakhulu, ukuhlangabezana neemfuno zemveliso ye-elektroniki yanamhlanje kwii-substrates ezinkulu.

Imveliso ephezulu: Ngenkqubo esebenzayo yokubumba, umatshini unokuphucula kakhulu ukusebenza kwemveliso kunye nokuqinisekisa umgangatho ophezulu wokuphuma.

Ukusebenza kunye nesivuno: Ukusetyenziswa kwee-substrates ezinkulu kunye nemveliso ephezulu kunye kuqinisekisa ukusebenza okungcono kunye nesivuno esiphezulu.

Inkqubo yokubumba i-chip ye-BESI AMS-LM TopFoil inomsebenzi we-TopFoil eyenza ukuveliswa kweemveliso ze-chip ezingenanto ngaphandle kokuphuphuma. I-TopFoil i-foil ekhethekileyo ikhokelwa ngaphezu kwesikhunta ukwenza i-cushion ethambileyo evimbela i-chip ukuba ihlanganiswe ne-compound, ikhuphe imfuno yesinyathelo esongezelelweyo sokucoca.

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Fico Ukubumba umgca AMS-LM FAQ

Iingcebiso ezinxulumeneyo
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