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The FuzionOF chip mounter has a production speed of up to 16,500 cph
The vacuum suction nozzle on the SMT head takes the component at the picking position
Maximum substrate processing size is 635mm x 610mm, and maximum wafer size is 300mm (12 inches)
●TO-can packaging processing capability
Able to handle small molds (as low as 3 mil) and large substrates (up to 270 x 100 mm), suitable for a variety of application scenarios.
The die bonder is also equipped with other auxiliary equipment, such as fans and cooling devices
The workbench design makes welding faster, more accurate and more stable.
The sensor detects the position and angle of the chip or substrate and transmits the data to the laser generator .
The advantages of the ASM laser cutting machine LS100-2 mainly include high precision, high efficiency and strong adaptability.
Operating speed : The equipment has a fast moving speed of 100m/min.
Single-beer configuration: The equipment provides two optional configurations of 120T and 170T, suitable for different production needs
Spray cleaning method is adopted to efficiently remove flux and organic and inorganic pollutants. The cleaning fluid spray pressure can be adjusted to correspond to different cleaning requirements to
he equipment is equipped with temperature and liquid level sensors, which can accurately control the temperature and liquid level of the solution in the tank to ensure that the temperature and liquid
The equipment has multiple cleaning modes and can clean different types of materials to ensure the cleaning effect and the integrity of components.
High-precision online DI water cleaning system for large semiconductor chips.
Precise detection: Through advanced visual inspection technology, MS90 can accurately identify and sort lamp beads to ensure the accuracy of sorting results.
Test points: TR50001T has 640 analog test points for complex circuit board testing.
Supports automatic learning and generation of test programs, automatic isolation point selection function, automatic judgment of signal source and signal inflow direction and other functions.
The MV-6E OMNI is equipped with 10-megapixel side cameras in the four directions of southeast, northwest, and northeast. This is the only J-pin detection solution that can effectively detect shadow de
MIRTEC 2D AOI MV-6e is a powerful automatic optical inspection equipment, which is widely used in various electronic manufacturing processes, especially in the inspection of PCB and electronic compon
Mirtec AOI VCTA A410 is an offline automatic optical inspection equipment (AOI) launched by the well-known manufacturer Zhenhuaxing. Since its launch, the equipment has undergone many improvements an
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As a supplier of equipment for the electronics manufacturing industry, Geekvalue offers a range of new and used machines and accessories from renowned brands at very competitive prices.
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