Samsung used Chip Mounter Excen pro with Flux Dipping Unit for PCB Prototype and SMT Assembly

Product DescriptionSamsung Used Chip Mounter Excen Pro with Flux Dipping Unit for PCB Prototype and SMT AssemblyBrief: SMD, SMT Chip MounterDetails1. High performance uses 16 suction nozzles and high-

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Description

Product Description

Samsung Used Chip Mounter Excen Pro with Flux Dipping Unit for PCB Prototype and SMT Assembly

Brief: SMD, SMT Chip Mounter
Details

1. High performance uses 16 suction nozzles and high-speed rotary heads to achieve the highest speed of 120000cph

2. Zero the waiting time between suction and pasting to improve the actual productivity

3. high reliability：Side-view Vision System (SVS) Suitable for high-speed and high-precision electric feeder

4. The laser sensor can identify the cocking (bending) of the component pin

5. High versatility production：Independent front and rear production, mixed flow production of different types of substrates, non-stop change of substrate, cross mounting

6. Convenient operation：By applying the ultra light monorail electric feeder, the convenience of the feeder is ensured

7. SMART Feeder：By automating the manual material receiving operation of replacing the component tray, the operation convenience and actual production are maximized，

Model	Excen Pro
PCB Specifications
PCB dimension	Dual lane mode: L50×W50mm to L330×W310mm
PCB exchange time	Dual lane mode: 0s* No 0s when cycle time is 3.6 s or less Single lane mode: 3.6s *When selecting short conveyors
Electric source	3-phase AC 200, 220, 380, 400, 420, 480 V 2.7 kVA
Pneumatic source ^*2	0.5 MPa, 100 L /min (A.N.R.)
Placement head	High speed head/multi function head
Placement head	high precison head
Max. speed	120,000 cph / 76 000 cph /20,000 cph
Placement accuracy (Cpk>=1)	±35 μm/cpk1.0(0402) / ±50 μm/cpk1.0(0402)
Component range/dimensions (mm)	0402 chip/01005 inch
Equipment size	1.2482.4201.447mm
Weight	Approx 2.350 kg (Only for main body : This differs depending on the option configuration.)

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