asm wire Bonding machine Eagle Aero Reel to Reel‌

ASM wire bonder Eagle Aero Reel to Reel‌ is a high-performance wire bonding equipment designed for semiconductor packaging and testing production. The following is a detailed introduction:

Features

‌High precision‌: Eagle Aero wire bonder adopts advanced optical positioning technology and high-precision motion control system to achieve high-precision wire bonding process‌.

‌Multi-function‌: Suitable for a variety of package types, including QFN, DFN, TQFP, LQFP packaging, as well as optical module COC, COB packaging‌.

‌High efficiency‌: With high-speed movement and fast wire change functions, it can greatly improve production efficiency‌.

‌Easy to operate‌: With a user-friendly operation interface and intelligent control system, it is easy to operate and learn‌.

Application scenario

Eagle Aero wire bonder is mainly used for wire bonding process in semiconductor packaging and testing production. The quality of wire bonding directly affects the reliability and performance of packaged products. Therefore, Eagle Aero wire bonder can meet the wire bonding needs of different package types and provide efficient and accurate wire bonding process for semiconductor packaging and testing production.

The working principle of the ASM wire bonder mainly includes the following steps:

‌ Clamping the chip or substrate ‌: First, the robot arm clamps the chip or substrate and moves it to the specified position ‌.

‌ Aligning the leads ‌: The drive system controls the movement of the robot arm so that the leads on the chip or substrate are aligned with the lens ‌.

‌ Position and angle detection ‌: The sensor detects the position and angle of the chip or substrate and transmits the data to the laser generator ‌.

‌ Laser welding ‌: The laser generator generates laser to weld the leads between the chip and the substrate ‌