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For complex PCB assemblies, X-ray images can reveal internal structures that are hidden beneath packages or within soldered connections. The BF-3AXiM200 is identified in the supplied product title as an SMT 3D X-ray machine, but its exact source, detector and motion-system specifications need to be verified before its capabilities can be compared with other models.
When evaluating a 3D X-ray system, distinguish ordinary 2D projection imaging from CT imaging. CT uses multiple views to reconstruct internal structures, while the results depend on the scan configuration, sample positioning, image resolution and inspection conditions. These modes should be assessed separately when estimating inspection time or deciding which defects can be evaluated.
For the BF-3AXiM200, confirm the X-ray source rating, detector resolution, supported PCB dimensions, sample-stage travel and any rotation or CT options. Installation planning should also account for the equipment footprint, electrical supply and manufacturer-specified radiation-safety requirements.
SAKI BF-3AXiM200 3D X-ray Inspection Equipment Specifications
| Item | Specification |
|---|---|
| Brand | SAKI |
| Model | BF-3AXiM200 |
| Inspection Method | 3D X-ray inspection, as stated in the supplied product title |
| X-Ray Source Rating | Confirm exact model |
| Detector Resolution | Confirm exact model |
| CT Capability | Confirm installed configuration |
| Sample-Stage Travel | Confirm original specification sheet |
| Maximum PCB Size | Confirm original specification sheet |
| Equipment Dimensions | Confirm machine documentation |
| Radiation-Safety Requirements | Refer to manufacturer documentation |
| Power Requirements | Refer to machine nameplate |
Configuration note: Do not transfer source ratings or resolution figures from the separately named SAKI 3Xi-M200 without written confirmation that they apply to the BF-3AXiM200.
