Automatic and precise loading/unloading for high-volume production.

11 degrees of freedom for improved calibration quality

●TO-can packaging processing capability

Able to handle small molds (as low as 3 mil) and large substrates (up to 270 x 100 mm), suitable for a variety of application scenarios.

The die bonder is also equipped with other auxiliary equipment, such as fans and cooling devices

The workbench design makes welding faster, more accurate and more stable‌.

The sensor detects the position and angle of the chip or substrate and transmits the data to the laser generator ‌.

The advantages of the ASM laser cutting machine LS100-2 mainly include high precision, high efficiency and strong adaptability. ‌

Operating speed ‌: The equipment has a fast moving speed of 100m/min.

Single-beer configuration‌: The equipment provides two optional configurations of 120T and 170T, suitable for different production needs‌

BESI's MMS-X mold machine is a manual version of the AMS-X mold machine‌. It uses a newly developed plate press with an extremely compact and rigid structure to obtain a perfect, flash-free end produc

The FML function of the BESI molding machine is mainly used for precise control and management during the packaging and electroplating process.