The ASMPT AERO CAM series wire bonder is specially designed for camera module packaging

The closed-loop coplanarity (TTV) of the ORCAS manual molding system is less than 20μm, ensuring high-precision laminating effects‌

high-precision cutting‌: DFL7341 uses laser invisible cutting technology to form a modified layer only inside the silicon wafer

The DFD6341 uses a unique rotary mechanism, the speed return of the X axis is increased to 1000 mm/s

YSH20 has a placement capability of up to 4,500 UPH (0.8 seconds/Unit), which is the top placement capability among flip chip placement machines

Chip Placer Type: C&P20 M2 CPP M, placement accuracy ±15 μm at 3σ.

DAD323 can handle processing objects up to 6 inches square,

DAD324 is suitable for various scenarios that require high-precision and miniaturized cutting

DAD3230 has excellent scalability and can handle a variety of processing materials and processing methods

Servo motors are used for all X, Y, and Z axes, achieving high-speed axes and improved productivity.

Double-sided cooling (DSC) mold solution is available to ensure temperature control during the plastic sealing process‌.

IdealMold™ R2R supports flexible programming and is suitable for different molding needs.