Ukulayisha / ukulayishwa okuzenzekelayo kunye nokuchanekileyo kwimveliso ephezulu.

I-11 degrees yenkululeko yokuphucula umgangatho wokulinganisa

●I-TO-ingakwazi ukupakisha ukupakisha ukusetyenzwa

Iyakwazi ukuphatha iimbumba ezincinci (eziphantsi kwe-3 mil) kunye ne-substrates enkulu (ukuya kwi-270 x 100 mm), ifanelekile kwiimeko ezahlukeneyo zesicelo.

I-die bonder nayo ixhotyiswe kunye nezinye izixhobo ezincedisayo, ezifana nabalandeli kunye nezixhobo zokupholisa

Uyilo lwebhentshi yokusebenzela yenza i-welding ikhawuleze, ichaneke ngakumbi kwaye izinzile.

Inzwa ibona indawo kunye ne-angle ye-chip okanye i-substrate kwaye idlulisela idatha kwi-generator laser.

Iinzuzo ze-ASM laser cutting machine LS100-2 ikakhulu ziquka ukuchaneka okuphezulu, ukusebenza kakuhle kunye nokulungelelanisa okunamandla.

Isantya sokusebenza : Isixhobo sinesantya esihamba ngokukhawuleza se-100m / min.

Ukucwangciswa kwebhiya enye: Isixhobo sibonelela ngeendlela ezimbini ezikhethiweyo ze-120T kunye ne-170T, ezifanelekileyo kwiimfuno ezahlukeneyo zemveliso.

Umatshini wokubumba we-BESI we-MMS-X yinguqulelo yesandla yomatshini wokungunda we-AMS-X. Isebenzisa ipleyiti yokushicilela esanda kuphuhliswa enesakhiwo esixinene kakhulu nesiqinile ukufumana isiphelo esigqibeleleyo, esingenambane.

Umsebenzi we-FML womatshini wokubumba we-BESI usetyenziswa ikakhulu kulawulo oluchanekileyo kunye nolawulo ngexesha lokupakishwa kunye nenkqubo ye-electroplating.