Inzwa ibona indawo kunye ne-angle ye-chip okanye i-substrate kwaye idlulisela idatha kwi-generator laser.

Iinzuzo ze-ASM laser cutting machine LS100-2 ikakhulu ziquka ukuchaneka okuphezulu, ukusebenza kakuhle kunye nokulungelelanisa okunamandla.

Isantya sokusebenza : Isixhobo sinesantya esihamba ngokukhawuleza se-100m / min.

Ukucwangciswa kwebhiya enye: Isixhobo sibonelela ngeendlela ezimbini ezikhethiweyo ze-120T kunye ne-170T, ezifanelekileyo kwiimfuno ezahlukeneyo zemveliso.

Umatshini wokubumba we-BESI's AMS-X ngumatshini wokubumba we-servo hydraulic ophucukileyo oneengenelo ezininzi kunye neempawu

Umatshini wokubumba we-BESI we-MMS-X yinguqulelo yesandla yomatshini wokungunda we-AMS-X. Isebenzisa ipleyiti yokushicilela esanda kuphuhliswa enesakhiwo esixinene kakhulu nesiqinile ukufumana isiphelo esigqibeleleyo, esingenambane.

Umsebenzi we-FML womatshini wokubumba we-BESI usetyenziswa ikakhulu kulawulo oluchanekileyo kunye nolawulo ngexesha lokupakishwa kunye nenkqubo ye-electroplating.

Umsebenzi ophambili womatshini we-BESI we-AMS-LM kukucubungula ama-substrates amakhulu kunye nokubonelela ngemveliso ephezulu kunye nokusebenza kakuhle kunye nemveliso. Umatshini uyakwazi ukusetyenzwa 102 x 280 mm substrates a

I-AMS-i kumatshini wokubumba we-fico yindibano ezenzekelayo kunye nenkqubo yovavanyo eveliswa yi-fico. I-fico yinkampani ye-semiconductor kunye ne-microelectronics yokuvelisa izixhobo ezikomkhulu eNetherlands.

I-wire bonder yenza kakuhle ekusebenzeni kwexesha elide kwaye inozinzo oluphezulu, olunokuqinisekisa ukuqhubeka nokuthembeka kwenkqubo yokuvelisa.

Ukuchaneka kwe-wire bonder yale ntambo yocingo ifikelela kwi-± 2 microns

I-AB589 ye-wire bonder sisixhobo sokubopha ucingo oluphezulu oluveliswe yi-ASMPT