I-AD420XL die bonder yenzelwe ukusebenza kakuhle engqondweni kwaye inokubonelela ngezisombululo ze-high-speed die bonding.

I-ASM die bonder SD8312 ithatha iinkqubo zokulawula eziphambili kunye nezakhiwo zoomatshini

I-coplanarity ye-loop evaliweyo (TTV) ye-ORCAS inkqubo yokubumba ngesandla ingaphantsi kwe-20μm, iqinisekisa iziphumo zokuchaneka okuphezulu.

Ukusika okuphezulu ngokuchanekileyo: I-DFL7341 isebenzisa itekhnoloji yokusika engabonakaliyo ye-laser ukwenza umaleko olungisiweyo kuphela ngaphakathi kwe-silicon wafer.

I-DFD6341 isebenzisa indlela ekhethekileyo yokujikeleza, ukubuya kwesantya se-X axis kunyuswe ukuya kwi-1000 mm / s.

Inkqubo inokusingatha iinkqubo ezininzi ze-chip kunye neenkqubo ezininzi kumatshini omnye

Iimathiriyeli ekrwada eziza kuhlelwa zondliwa kwizibuko lokutya likamatshini wokuhlela ngebhanti lokuhambisa okanye ivibrator.

I-AD280 Plus die bonder ine-high-chane-chane ye-die bonding, enokuqinisekisa ukubekwa okuchanekileyo kwamacandelo.

Isikhululo sophando se-UF3000EX samkela umgaqo-siseko wetshiphu osebenza kakuhle kakhulu kunye nenkqubo yokuqhuba ukuqinisekisa ukusebenza ngesantya esiphezulu nangengxolo ephantsi yeqonga le-X kunye ne-Y.

Umatshini wokuhlola we-AP3000/AP3000e unokufezekisa ukuchaneka okuphezulu, uvavanyo oluphezulu, olufanelekileyo ngakumbi kwiimfuno ezinkulu zemveliso.

Uluhlu lwayo oluguquguqukayo lubanzi kakhulu, kunye nexabiso eliqhelekileyo le-130dB (IFBW 10Hz), ekwazi ukuphatha imisebenzi yokulinganisa efana kakhulu.

I-V93000 inokufikelela kwizantya zovavanyo ukuya kuthi ga kwi-100GHz, ihlangabezane neemfuno zovavanyo olukwisantya esiphezulu kunye nezingasebenziyo.