The AP3000/AP3000e probe machine can achieve high-precision, high-throughput testing, especially suitable for large-scale production needs‌

Its dynamic range is very wide, with a typical value of 130dB (IFBW 10Hz), capable of handling highly similar measurement tasks‌

V93000 can achieve test speeds up to 100GHz, meeting high-speed and invalid high-speed testing needs ‌

It can meet a variety of LED packaging specifications, including common products such as 3528 and 5050

The wire bonding speed reaches 1.8K (four wires plus four gold balls), significantly improving production efficiency‌

Its instantaneous production capacity can reach 15,000UPH, which is equivalent to twice the factory production capacity‌

MAXUM PLUS In most applications, productivity (UPH) is increased by 10% over the previous generation

Production capacity Datacon 8800 has extremely high production efficiency and can significantly improve production speed. For example

●TO-can packaging processing capability

Able to handle small molds (as low as 3 mil) and large substrates (up to 270 x 100 mm), suitable for a variety of application scenarios.

The die bonder is also equipped with other auxiliary equipment, such as fans and cooling devices

The workbench design makes welding faster, more accurate and more stable‌.