The AD420XL die bonder is designed with efficiency in mind and can provide high-speed die bonding solutions

The ASM die bonder SD8312 adopts advanced control systems and mechanical structures

The closed-loop coplanarity (TTV) of the ORCAS manual molding system is less than 20μm, ensuring high-precision laminating effects‌

high-precision cutting‌: DFL7341 uses laser invisible cutting technology to form a modified layer only inside the silicon wafer

The DFD6341 uses a unique rotary mechanism, the speed return of the X axis is increased to 1000 mm/s

The system can handle multi-chip and multi-process applications in one machine

The raw materials to be sorted are fed into the feed port of the sorting machine through a conveyor belt or vibrator

The AD280 Plus die bonder has high-precision die bonding capabilities, which can ensure the precise placement of components

The UF3000EX probe station adopts the new high-efficiency chip principle and drive system to ensure high-speed and low-noise operation of the X and Y axis platforms

The AP3000/AP3000e probe machine can achieve high-precision, high-throughput testing, especially suitable for large-scale production needs‌

Its dynamic range is very wide, with a typical value of 130dB (IFBW 10Hz), capable of handling highly similar measurement tasks‌

V93000 can achieve test speeds up to 100GHz, meeting high-speed and invalid high-speed testing needs ‌