Ukukhangela ngokukhawuleza
imveliso FAQ
Umgangatho ophezulu wokuwelda: I-Sonic Reflow Oven K1-1003V inokufikelela kwi-welding ekumgangatho ophezulu, kwaye umgangatho we-welding uzinzile kwaye uthembekile.
I-oven ye-XPM2 yokubuyisela i-oven ithatha inkqubo yokujikeleza kwamandla okushisa aphezulu, enokugcina umbane phantsi kozinzo oluphezulu, ngaloo ndlela inciphisa iindleko zokuvelisa.
Ukwamkela isoftware yolawulo lwamandla kaHELLER, izixhobo zokukhupha umoya zihlengahlengiswa ngokuzenzekelayo ngokwemo yemveliso.
Umatshini wokukhupha iglu ozenzekela ngokugqibeleleyo unokuchaneka okuphezulu kakhulu ekulawuleni ubungakanani bokukhutshwa kweglue
Ngokusebenza ngokuzenzekelayo, umatshini wokuzalisa iglu unokugqiba ngokukhawuleza nangokuchanekileyo ukuzaliswa kweglue okanye i-sealant, ukunciphisa kakhulu umjikelezo wemveliso.
Iimeko zesicelo somatshini wokuzalisa iglue zibanzi kakhulu, ikakhulu zibandakanya iinkqubo ezifuna iglue okanye ukusetyenzwa kolwelo.
I-SE600 yimodeli ye-CyberOptics kwaye iyinxalenye yenkqubo yeSPI. Idibanisa ukuchaneka okuphezulu kunye nokusebenza komgangatho wehlabathi ukubonelela ngeqonga eliphezulu lokusebenza
I-QX600™ isebenzisa i-SAM (i-Statistical Shape Modeling) ubuchwepheshe bombono kunye ne-AI2 (i-Autonomous Image Interpretation)
I-Versatility: Ifanelekile kwizicelo ezininzi ezifana ne-AOI, i-SPI, kunye ne-CMM, inokuchonga iziphene ezibalulekileyo kunye nokulinganisa iiparitha eziphambili.
I-QX150i ixhasa uhlolo olumacala mabini kwaye inokubona iziphene ezahlukahlukeneyo zokuthengisa kwiibhodi zePCB.
Ukuphucula ukusebenza kakuhle kwemveliso kunye nokunciphisa iimpazamo zokugquma: Ngokusebenza ngoomatshini kunye nolawulo lwedijithali
Umatshini wokugquma unokulawula ngokuchanekileyo inani lokutshiza, indawo kunye nommandla wokugquma ukuze kuqinisekiswe ukufana kunye nokuhambelana kwesiphumo sokugquma.
Oomatshini bokugquma bePCB basetyenziswa kakhulu kwimveliso ye-elektroniki, izixhobo zonxibelelwano, ii-automotive electronics
Umatshini wokugquma we-PCB ulawula ngokuchanekileyo ivalve yokugquma kunye nomzila wokuhambisa ukuze ulungelelanise ngokulinganayo nangokuchanekileyo umaleko kwindawo echongiweyo yebhodi yesekethe.
Ukubekwa kwesantya esiphezulu: I-MY300 inokubeka i-224 i-smart feeder kwi-40% yeenyawo ezincinci kunemodeli yangaphambili.
Ukukhuphisana kwesikhululo sokusebenza kwakhona se-BGA kwimarike kubonakaliswa ikakhulu ekusebenzeni kwayo, ukulunga kunye nokuchaneka okuphezulu.
Izixhobo zokusebenza kwakhona ze-BGA zinokufezekisa ukusebenza okuchanekileyo ngobuchwepheshe obuphambili bokuqinisekisa ukuchaneka kokulungiswa
Isikhululo se-BGA rework sifudumeza itshiphu ye-BGA ngokusebenzisa isixhobo sokufudumeza esisezantsi ukunyibilikisa amalungu e-solder ezantsi.
Imisebenzi ephambili yesikhululo sokuphinda sisebenze i-BGA ibandakanya ukususwa okuchanekileyo kweetshiphusi ezonakalisiweyo, ukulungiswa kweendawo ezithengiswayo, ukuphinda kufakwe i-chips, ukuhlolwa kunye nokulinganisa.
Tshisa iitshiphusi ezine ngexesha elinye, iityhubhu ezili-12 zokutyisa kunye neetyhubhu ezili-13 zokukhupha, kunye nenqanaba eliphezulu lokuzisebenzela.
Ngolawulo olunamandla lwesoftware, isitshisi se-IC sinokuqonda imisebenzi engaguqukiyo efana nokutya okuzenzekelayo kwe-IC
I-Geekvalue: Uzalelwe oomatshini bokuKhetha-neNdawo
Inkokeli yesisombululo esinye sokumisa i-chip mounter
Ngathi
Njengomthengisi wezixhobo kushishino lokwenziwa kombane, iGeekvalue ibonelela ngoluhlu loomatshini abatsha nabasele besetyenzisiwe kunye nezixhobo ezisuka kwiibrendi ezaziwayo ngamaxabiso akhuphisana kakhulu.
imveliso
SAKI AOI umatshini wesmt Izixhobo zeSemiconductor umatshini wepcb Umatshini wokulebula ezinye izixhoboIsisombululo somgca we-SMT
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