BGA rework station R7220A

Imisebenzi ephambili yesikhululo sokusebenza kwakhona se-BGA ibandakanya ukususwa ngokuchanekileyo kweetshiphusi ezonakalisiweyo, ukulungiswa kweendawo ezithengiswayo, ukuphinda kufakwe i-chips, ukuhlolwa kunye nokulinganisa, kunye nokuphucula ukulungiswa kakuhle. Ngokukodwa:

Ukususwa okuchanekileyo kweetshiphusi ezonakalisiweyo: Isikhululo sokusebenza kwakhona se-BGA sinokunika ubushushu obufanayo kunye nokulawulwayo ukunyibilikisa iibhola ze-solder malunga ne-chip, ngaloo ndlela kufezekiswa ukususwa okungonakalisi kwetshiphu. Ngokulawula iindawo zokufudumeza kunye neeprofayili zeqondo lokushisa, isikhululo sokuphinda sisebenze sinokuqinisekisa ukuba ibhodi yesiphaluka okanye amanye amacandelo angonakaliswa ngexesha lokususwa.

Lungiselela i-solder surface: Emva kokususa i-chip, isikhululo sokusebenza kwakhona sinokunceda ukususa i-solder eseleyo kwibhodi ye-PCB kwaye unikeze indawo ecocekileyo kunye ne-flat for re-soldering. Eli nyathelo libalulekile ukuqinisekisa umgangatho wokuthengiswa kwetshiphu entsha.

I-Chips yokuphinda ithengise i-Chips: Isikhululo sokusebenza kwakhona sixhotyiswe ngenkqubo yokulungelelanisa ephezulu kunye neqonga lokufudumeza, elinokuthi libeke ngokuchanekileyo i-chip entsha ye-BGA kwindawo echongiweyo, ukuqinisekisa ukuba zonke iibhola ze-solder zihambelana ngokugqibeleleyo kunye neepads ezihambelanayo. Ngokufudumeza okufanayo, isikhululo sokuhlaziya sinokufezekisa i-reflow soldering ethembekileyo, iphucule ukuqina kwamalungu e-solder, kunye nokunciphisa amathuba okuxhamla ama-solder angamanga kunye nokudibanisa okubandayo.

Ukuhlola kunye noCalibration: Izitishi ze-BGA ezikumgangatho ophezulu zixhotyiswe ngeenkqubo zokuhlola amehlo kunye nezixhobo zokuhlola i-X-ray, ezinokuthi zenze uhlolo olubonakalayo kunye nokufumanisa isiphene sangaphakathi ngaphambi nangemva kwe-welding ukuqinisekisa umgangatho we-welding.

Ukuphucula ukusebenza kakuhle kokulungisa: Izitishi ze-BGA zanamhlanje zihlala zixhasa umgangatho othile wokusebenza okuzenzekelayo ukunciphisa ukungenelela ngesandla kunye nokuphucula ukulungiswa kakuhle. Ujongano lomsebenzisi olubambekayo luvumela abaqhubi ukuseta ngokulula iiparamitha kwaye babeke iliso kwinkqubo, behlisa umda wobugcisa.

Ukubaluleka kwesikhululo sokusebenza kwakhona kwe-BGA ekulungisweni kwezixhobo ze-elektroniki kubonakala kule miba ilandelayo:

Ukuphucula ukusebenza kakuhle kogcino: Isikhululo sokusebenza kwakhona se-BGA sinokugqiba ngokukhawuleza nangokuchanekileyo ukugcinwa kweetshiphusi ze-BGA, ukuphucula kakhulu ukusebenza kakuhle

Ukunciphisa iindleko zokulungisa : Ngokulungisa iitshiphusi ezingaphumelelanga kunokutshintsha yonke ibhodi okanye isixhobo, isikhululo sokusebenza kwakhona seBGA sinciphisa iindleko zokulungisa.

Umgangatho wokulungisa oqinisekisiweyo: Ulawulo oluchanekileyo lobushushu, inkqubo yolungelelwaniso lwamehlo kunye nemisebenzi yokuhlola iqinisekisa ukufakwa kunye nomgangatho wokuthengisa we-chips ze-BGA.

Ngokubhekiselele kububanzi besicelo, isikhululo sokuphinda sisetyenziselwe i-BGA singasetyenziselwa kuphela izixhobo ezincinci zombane ezinjengeefowuni eziphathwayo, iikhompyuter zethebhulethi, kunye neelaptops, kodwa nakwizixhobo ezinkulu zombane ezinje ngeeseva kunye nezixhobo zolawulo lwamashishini, kwaye inoluhlu olubanzi lwezixhobo zombane. izicelo ezilindelekileyo.