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Umgaqo osisiseko wesikhululo sokusebenza kwakhona se-BGA kukuqinisekisa ukufudumeza okufanayo kunye nokuzinza kwakhona ngokufudumeza okuphantsi kunye nokubeka phezulu. Xa ususa i-chip ye-BGA, i-CSP ephezulu (i-package ye-chip scale pack) isuswe ngokufudumeza ezantsi, efuna umsebenzi ochanekileyo wobugcisa.
Ingaba isebenza kanjani
Ukufudumeza ezantsi: Isikhululo se-BGA rework sifudumeza itshiphu ye-BGA ngokusebenzisa isixhobo sokufudumeza esisezantsi ukunyibilikisa amalungu e-solder ezantsi, ngaloo ndlela kufezekiswa ukususwa kwetshiphu kunye nofakelo.
Ukubekwa okuphezulu: Ngelixa ukufudumeza, inkqubo yokumisa ephezulu iqinisekisa ulungelelwaniso oluchanekileyo lwe-chip ukuthintela ukutenxa ngexesha lenkqubo ye-welding.
Ulawulo lobushushu: Izikhululo ze-BGA zokuphinda zisebenze zihlala zixhotyiswe ngeenkqubo ezizimeleyo zokulawula ubushushu be-elektroniki, ezinokuhlengahlengisa ubushushu be-soldering ngexesha lokwenyani ukuphepha ukonakala kwetshiphu ngenxa yobushushu obuphezulu okanye obuphantsi kakhulu.
Umahluko kwimigaqo yokusebenza yeentlobo ezahlukeneyo zezikhululo ze-BGA zokuphinda zisebenze
Izikhululo ze-BGA zinokwahlulwa zibe ziindidi ezimbini: ulungelelwaniso lwamehlo kunye nolungelelwaniso olungelulo-optical:
Ukulungelelaniswa kwe-Optical: Ukulungelelaniswa ngenkqubo ye-optical iqinisekisa ukuchaneka ngexesha le-welding kunye nokuphucula izinga lokuphumelela.
Ukulungelelaniswa kwe-non-optical: Ulungelelwaniso lwenziwa ngumbono, ngokuchaneka okuphantsi
Indlela yokufudumeza
Indlela yokufudumeza yesikhululo sokusebenza kwakhona se-BGA iqhelekile ziindawo ezintathu zobushushu:
Umoya oshushu ophezulu nasezantsi: Ukufudumeza ngocingo lokufudumeza, kunye nokuhambisa umoya oshushu kumacandelo e-BGA ngombhobho womoya ukukhusela ibhodi yesekethe ekubeni ikhubazeke ngokufudumeza okungalinganiyo.
Ukufudumeza okuphantsi kwe-infrared: ubukhulu becala kudlala indima yokufudumala, kususa umswakama ngaphakathi kwebhodi yesekethe kunye ne-BGA, kwaye kunciphisa ithuba lokuguqulwa kwebhodi yesekethe.
