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Mabda'a aasaasiga ah ee xarunta dib-u-shaqaynta BGA waa in la hubiyo kuleylinta isku midka ah iyo dib u habeynta xasilloonida iyada oo loo marayo kuleylinta hoose iyo meelaynta sare. Marka la saarayo chip-ka BGA, CSP-ga sare (xirmada cabbirka chip) waa la saarayaa iyadoo la kululeynayo hoosta, taas oo u baahan hawl farsamo oo sax ah.

Sida ay u shaqeyso

Kuleylinta hoose: Xarunta dib-u-shaqaynta BGA waxay kuleylisaa chip-ka BGA iyada oo loo marayo qalabka kuleylka hoose si ay u dhalaaliso kala-goysyada alxanka ee hoose, si loo gaaro ka saarista jajabka iyo rakibida

Meelaynta sare: Inta lagu jiro kululaynta, nidaamka meelaynta sare wuxuu hubinayaa toosinta saxda ah ee chip si looga hortago leexashada inta lagu jiro habka alxanka

Xakamaynta heerkulka: Saldhigyada dib-u-shaqaynta BGA waxaa badanaa lagu qalabeeyaa hababka xakamaynta heerkulka elektiroonigga ah, kuwaas oo hagaajin kara heerkulka alxanka wakhtiga dhabta ah si looga fogaado burburka jajabka sababtoo ah heerkul aad u sarreeya ama hooseeya.

Farqiga u dhexeeya mabaadi'da shaqada ee noocyada kala duwan ee xarumaha dib-u-shaqaynta BGA

Saldhigyada dib-u-shaqaynta BGA waxa loo qaybin karaa laba nooc: toosinta indhaha iyo toosinta aan indhaha ahayn:

Isku-habaynta indhaha: Ku-habaynta nidaamka indhaha waxay hubisaa saxnaanta inta lagu jiro alxanka waxayna hagaajinaysaa heerka guusha.

Toosinta aan indhaha ahayn: Isku toosinta waxa lagu sameeyaa aragti, iyada oo saxsanaan yar

Habka kululaynta

Habka kululaynta ee xarunta dib-u-shaqaynta BGA guud ahaan waa saddex aag heerkul ah:

Hawada kulul ee sare iyo tan hoose: Kuleylinta siliga kuleyliyaha, iyo ku wareejinta hawada kulul qaybaha BGA iyada oo la marayo birta hawada si looga hortago in looxa wareegga uu xumaado kuleyl aan sinnayn

Kuleylinta infrared-ka hoose: badiyaa wuxuu ciyaaraa door kulaylka hore, wuxuu ka saaraa qoyaanka gudaha guddiga wareegga iyo BGA, wuxuuna yareeyaa fursadda qallafsanaanta guddiga wareegga