geekvalue bga rework station gk730a

The basic principle of the BGA rework station is to ensure uniform heating and rework stability through bottom heating and upper positioning. When removing the BGA chip, the upper CSP (chip scale package) is removed by heating the bottom, which requires precise technical operation.

How it works

‌Bottom heating‌: The BGA rework station heats the BGA chip through the bottom heating device to melt the solder joints at the bottom, thereby achieving chip removal and installation‌

‌Upper positioning‌: While heating, the upper positioning system ensures the accurate alignment of the chip to prevent deviation during the welding process‌

Temperature control: BGA rework stations are usually equipped with independent electronic temperature control systems, which can adjust the soldering temperature in real time to avoid chip damage due to excessively high or low temperatures.

Differences in working principles of different types of BGA rework stations

BGA rework stations can be divided into two types: optical alignment and non-optical alignment:

Optical alignment: Alignment through the optical system ensures accuracy during welding and improves the success rate.

‌Non-optical alignment‌: Alignment is done by vision, with relatively low accuracy‌

Heating method

The heating method of the BGA rework station is generally three temperature zones:

‌Top and bottom hot air‌: Heating through the heating wire, and transferring hot air to the BGA components through the air nozzle to prevent the circuit board from being deformed by uneven heating‌

‌Bottom infrared heating‌: mainly plays a preheating role, removes moisture inside the circuit board and BGA, and reduces the chance of circuit board deformation‌