Semiconductor equipment

Izixhobo zeSemiconductor - Iphepha2

Umatshini weSemiconductor

Umsebenzi ophambili wezixhobo zokupakisha kukusika kunye nokutywina ii-wafers emva kwemveliso kunye nokusetyenzwa, kwaye emva koko zisetyenzwe zibe ziichips ezigqityiweyo. Inkqubo yokupakisha ibandakanya i-wafer thinning, i-wafer cut, i-chip mounting, i-welding bonding, inkqubo yokutywinwa kweplastiki, inkqubo yokunyanga emva kokunyanga, ukuvavanya, inkqubo yokumakisha (i-electroplating, ukugoba, ukuprintwa kwe-laser), ukupakishwa, ukuhlolwa kwendawo yokugcina impahla, ukuthumela kunye nezinye iinkqubo. Indima yokupakishwa kukukhusela ukusebenza kwetshiphu, ukunciphisa ubunzima bobugcisa, kunye nokuphucula ukusebenza kwemveliso kunye nezinga lesivuno.

Ukukhangela ngokukhawuleza

Izixhobo zeSemiconductor FAQ

GEEKVALUE

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Inkokeli yesisombululo esinye sokumisa i-chip mounter

Ngathi

Njengomthengisi wezixhobo kushishino lokwenziwa kombane, iGeekvalue ibonelela ngoluhlu loomatshini abatsha nabasele besetyenzisiwe kunye nezixhobo ezisuka kwiibrendi ezaziwayo ngamaxabiso akhuphisana kakhulu.

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