Semiconductor ukupakisha ukucoca umatshini FC750

Iimpawu ezisebenzayo zokupakishwa komatshini wokuhlamba amanzi we-semiconductor ozenzekela ngokuzeleyo kwi-intanethi yeyona miba ilandelayo:

Ukucocwa komgangatho ophezulu: I-semiconductor chip yokupakisha ngokugqibeleleyo umatshini wokuhlamba amanzi kwi-intanethi ithatha i-agent ephezulu yokucoca kunye neenkqubo ezikhethekileyo zokucoca, ezinokuhlambulula inani elikhulu lamacandelo ngexesha elifutshane, ukuphucula kakhulu ukusebenza kwemveliso kunye nomgangatho wemveliso.

I-Versatility: Isixhobo sineendlela ezininzi zokucoca kwaye zinokucoca iintlobo ezahlukeneyo zezixhobo zokuqinisekisa umphumo wokucoca kunye nokuthembeka kwamacandelo.

Ulawulo oluzenzekelayo: Inkqubo yokulawula ngokuzenzekelayo yamkelwe ukufezekisa isiqalo seqhosha elinye, ukunciphisa ukusebenza ngesandla, kunye nokuphucula ukusebenza kakuhle kwemveliso.

Ukonga amandla kunye nokukhuselwa kwendalo: Isixhobo samkela uyilo oluvaleleke ngokupheleleyo lokunciphisa ukusetyenziswa kwamandla kunye nongcoliseko lokusingqongileyo.

Ubuchwephesha bokucoceka kwamanzi aphakamileyo: I-teknoloji yokucoca amanzi e-Ultrapure isetyenziselwa ukuqinisekisa ukuba akukho kungcola okungeniswa ngexesha lokucoca ukuhlangabezana neemfuno zokuvelisa ezichanekileyo.

Ukukhuselwa kwendalo: Umatshini wokuhlamba amanzi kwi-intanethi awufuni ukusetyenziswa kwanoma yiyiphi i-reagents yeekhemikhali ezinobungozi, kwaye ayivelisi nayiphi na igesi engcolileyo enobungozi kunye namanzi amdaka, ahlangabezana neemfuno zokukhusela indalo.

Ubukrelekrele kunye ne-automated: Ngophuhliso lwesayensi kunye neteknoloji, oomatshini bokuhlamba amanzi kwi-intanethi kwixesha elizayo baya kuba krelekrele ngakumbi kwaye bazenzekele, ukuphucula ukusebenza kakuhle kokucoca kunye nokucoca umgangatho.

Izinto eziluncedo zoomatshini bokuhlamba amanzi kwi-intanethi ngokuzenzekela ngokugqibeleleyo kwi-semiconductor chip package ikakhulu ibandakanya ukucoca okusebenzayo, ukusebenza okuzenzekelayo, kunye nococeko oluphezulu.

Ukucoca ngokufanelekileyo: Umatshini wokuhlamba wamanzi we-intanethi ozenzekelayo ngokugqibeleleyo wokupakisha i-semiconductor chip wamkela iindlela ezahlukeneyo zobuchwepheshe bokucoca kunye neendlela, ezinje ngokucoca nge-ultrasonic, ukucocwa kweekhemikhali, kunye nokucoca ukutshiza, okunokucoca ngokucokisekileyo inani elikhulu leetshiphusi ze-semiconductor ngexesha elifutshane. qinisekisa ukucoceka komphezulu.

Ukusebenza okuzenzekelayo: Ukulawulwa yi-PLC (umlawuli we-logic ecwangcisiweyo) kunye nesikrini sokuchukumisa, iqonda ukusebenza ngokuzenzekelayo ngokuzenzekelayo ukusuka ekulayisheni, ukucoca, ukomisa ukukhulula, ukunciphisa ukungenelela kwabantu kunye nokuphucula ukusebenza kakuhle kwemveliso kunye nokuhambelana2. Ukongezelela, izixhobo zihlala zixhotyiswe ngamanyathelo okukhusela okukhuselekileyo njengokuthintela ukuvuza, ukuthintela umlilo, ukuthintela ukuqhuma, njl.njl ukuqinisekisa ukhuseleko lokusebenza.

Ukucoceka okuphezulu: Sebenzisa izisombululo zeekhemikhali ezicocekileyo kunye namanzi ahlambulukileyo ukuze uqinisekise ukucoceka kwendawo ye-chip kwaye ugweme ukungcola okwesibini. Umphezulu we-chip emva kokucoca awunayo ioli, uthuli kunye nezinye izinto ezingcolileyo