Okunoonya amangu
the bonder FAQ
Die bonder era erimu ebyuma ebirala ebiyamba, gamba nga ffaani n’ebyuma ebinyogoza
Asobola okukwata ebibumbe ebitonotono (nga wansi nga 3 mil) ne substrates ennene (okutuuka ku mm 270 x 100), ebisaanira embeera ez’enjawulo ez’okukozesa.
●TO-can okupakinga okulongoosa obusobozi
AD280 Plus die bonder erina obusobozi bwa high-precision die bonding, ekiyinza okukakasa nti ebitundu biteekebwa bulungi
Enkola eno esobola okukwata enkola za chip eziwera n’enkola eziwera mu kyuma kimu
ASM die bonder SD8312 yeettanira enkola ez’omulembe ez’okufuga n’ensengekera z’ebyuma
AD420XL die bonder ekoleddwa nga etunuulidde bulungi era esobola okuwa die bonding solutions ez’amaanyi
AD8312 Plus positioning die bonder egatta ebirungi ebiri mu ultra-fast ne positioning
Ebyuma bino birina omulimu ogw’obutuufu ogw’amaanyi era bisobola okutuuka ku kufuga okutuufu okwa ±7um@3σ ne ±1°@3σ
Die bonder ekoleddwa nga ekyukakyuka era esobola okukwata motherboards eza sayizi n’enkula ez’enjawulo
ASM AD832i die bonder erongoosa nnyo enkola y’okufulumya ng’eyita mu nkola yaayo ennungi ey’emirimu n’okukola mu ngeri ey’otoma
Obusobozi bw’okufulumya Datacon 8800 erina obulungi ennyo mu kukola era esobola okulongoosa ennyo sipiidi y’okufulumya. okugeza nga
Geekvalue: Yazaalibwa ku byuma ebilonda n’okuteeka
Omukulembeze w'okugonjoola ensonga emu ku chip mounter
Ebitukwatako
Ng’omugabi w’ebyuma eri abakola ebyuma, Geekvalue ekuwa ebyuma ebipya n’ebikozesebwa n’ebikozesebwa okuva mu bika eby’amaanyi ku bbeeyi evuganya ennyo.
ekyamaguzi
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