Ukukhangela ngokukhawuleza
i-FAQ yebhondi
I-die bonder nayo ixhotyiswe kunye nezinye izixhobo ezincedisayo, ezifana nabalandeli kunye nezixhobo zokupholisa
Iyakwazi ukuphatha iimbumba ezincinci (eziphantsi kwe-3 mil) kunye ne-substrates enkulu (ukuya kwi-270 x 100 mm), ifanelekile kwiimeko ezahlukeneyo zesicelo.
●I-TO-ingakwazi ukupakisha ukupakisha ukusetyenzwa
I-AD280 Plus die bonder ine-high-chane-chane ye-die bonding, enokuqinisekisa ukubekwa okuchanekileyo kwamacandelo.
Inkqubo inokusingatha iinkqubo ezininzi ze-chip kunye neenkqubo ezininzi kumatshini omnye
I-ASM die bonder SD8312 ithatha iinkqubo zokulawula eziphambili kunye nezakhiwo zoomatshini
I-AD420XL die bonder yenzelwe ukusebenza kakuhle engqondweni kwaye inokubonelela ngezisombululo ze-high-speed die bonding.
I-AD8312 Plus yokubeka i-die bonder idibanisa iingenelo ze-ultra-fast kunye nokubeka
Isixhobo sisebenza ngokuchaneka okuphezulu kwaye sinokufikelela kulawulo oluchanekileyo lwe-±7um@3σ kunye ±1°@3σ.
I-die bonder yenzelwe ukuba ibe bhetyebhetye kwaye inokuphatha ii-motherboards zobukhulu obahlukeneyo kunye neemilo
I-ASM AD832i die bonder iphucula kakhulu impumelelo yemveliso ngokuqhutywa kwayo okusebenzayo kunye nokusebenza okuzenzekelayo
Umthamo wokuvelisa i-Datacon 8800 inemveliso ephezulu kakhulu kwaye inokuphucula kakhulu isantya semveliso. Umzekelo
I-Geekvalue: Uzalelwe oomatshini bokuKhetha-neNdawo
Inkokeli yesisombululo esinye sokumisa i-chip mounter
Ngathi
Njengomthengisi wezixhobo kushishino lokwenziwa kombane, iGeekvalue ibonelela ngoluhlu loomatshini abatsha nabasele besetyenzisiwe kunye nezixhobo ezisuka kwiibrendi ezaziwayo ngamaxabiso akhuphisana kakhulu.
imveliso
umatshini wesmt Izixhobo zeSemiconductor umatshini wepcb Umatshini wokulebula ezinye izixhoboIsisombululo somgca we-SMT
© Onke Amalungelo Agciniwe. Inkxaso yobuGcisa:TiaoQingCMS
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