TRI TR7700SIII SMT 3D AOI Inspection System

TR7700SIII is an innovative 3D automatic optical inspection machine (AOI) that uses ultra-high-speed hybrid PCB inspection methods, optical and blue laser 3D true profile measurement technology to maximize automatic inspection defect coverage. The device combines the most advanced software solutions and the third-generation intelligent hardware platform to provide stable and powerful 3D solder joint and component defect detection, with advantages such as high detection coverage and easy programming.

Technical specifications and performance parameters

‌ Inspection capability ‌: TR7700SIII supports high-speed 2D+3D inspection and can detect 01005 components.

‌ Inspection speed ‌: 2D inspection speed is 60cm²/sec at 10µm resolution; 2D inspection speed is 120cm²/sec at 15µm resolution; 27-39cm²/sec in 2D+3D mode.

‌ Optical system ‌: Dynamic imaging technology, true 3D profile measurement, multi-phase RGB+W LED lighting.

‌ 3D technology ‌: Equipped with single/dual 3D laser sensors, maximum 3D range is 20mm ‌.

Advantages and application scenarios

‌High defect coverage: Hybrid 2D+3D inspection technology provides high defect coverage.

‌True 3D contour measurement technology: Dual laser units provide more accurate measurements.

‌Intelligent programming interface: With automated database and offline programming functions, the programming process is simplified.

User evaluation and market positioning

TR7700SIII 3D AOI enjoys a high reputation in the market for its high performance and high coverage, and is suitable for electronic manufacturing companies that require high-precision inspection. Its innovative 3D inspection technology and simple programming functions give it a significant advantage in the field of automated inspection.

‌The main advantages of the TR7700SIII 3D automatic optical inspection machine (AOI) include:

‌High-speed 2D+3D inspection: The equipment uses an ultra-high-speed hybrid PCB inspection method, combining optical and blue laser 3D true contour measurement, capable of detecting components up to 01005, with the advantages of high defect coverage and simple programming. ‌True 3D contour measurement technology‌: Use dual laser units for true 3D contour measurement to ensure detection accuracy‌.

‌Intelligent hardware platform‌: Combines the most advanced software solutions and the third-generation intelligent hardware platform to provide stable and powerful 3D solder point and component defect detection‌.

‌High-precision detection‌: Equipped with high-precision AOI with multi-phase light source, using new color space algorithm to improve accuracy and reduce misjudgment‌.

‌Intelligent fast programming interface‌: Equipped with automated database and offline programming functions to simplify the programming process‌