Vitronics Soltec smt reflow oven XPM3i

The main function of the Flextronics XPM3 reflow oven is to perform reflow soldering to ensure reliable connections between electronic components and circuit boards. Reflow soldering is to melt the solder paste at high temperature so that it evenly covers the soldering points, and then form a reliable solder connection during the cooling process. This process requires precise control of temperature and time to ensure welding quality and reliability.

Specific functions and technical features

Flux Flow ControlTM: Effectively remove flux impurity precipitation in each temperature zone and heating channel to achieve maintenance-free

Computer-controlled chain lubrication system: Ensure smooth operation of the production line

Flux flow control: Solve the problem of flux volatilization, PCB release of waste gas and sufficient emission of gaseous pollutants without losing inert gas or nitrogen

POLAR water cooling technology: Built-in heat exchanger provides excellent cooling effect and reduces heat loss

8 heating zones and 2 cooling zones: Each temperature zone operates independently with little mutual interference, ensuring the stability and consistency of the welding process

Windows operation interface: Easy to operate, with three levels of operation permissions and password protection to ensure the safety and convenience of operation

Application scenarios and industry impact

Flextronics XPM3 reflow oven is widely used in SMT production lines, especially in the electronic assembly process, it can ensure the quality and reliability of solder joints, improve production efficiency and reduce defective product rates. In modern electronic products, the quality of solder joints is directly related to the overall performance and life of the product, so the importance of reflow ovens is self-evident