Zenith uses 3D measurement values to detect and identify the following defects: [solder leaks, offsets, polarity, flip-over, OCV/OCR

Viscom AOI 3088 uses innovative camera technology to achieve good detection depth and accurate 3D measurement

The V510 3D AOI is widely used in multiple industries, including network, telecommunications, automotive, semiconductor/LED, electronic manufacturing services

QX600™ adopts SAM (Statistical Shape Modeling) vision technology and AI2 (Autonomous Image Interpretation) technology

‌Versatility‌: Suitable for multiple applications such as AOI, SPI, and CMM, it can identify critical defects and measure key parameters

The QX150i supports two-dimensional inspection and can detect various soldering defects on PCB boards

Omron VT-RNSII has high-precision detection capabilities and can detect image resolutions of 10, 15, and 20um‌

Multiple detection methods‌: YSi-V supports 2D, 3D and 4D detection methods, enabling high-quality detection‌

‌3D inspection accuracy‌: 8-direction projection device, 4-direction oblique image inspection, 20-megapixel 4-direction oblique camera

iS6059 uses innovative 3D camera technology to perform shadow-free and high-precision inspection of THT components

Viscom-iS6059-Plus is an intelligent networked PCB inspection system with excellent computing performance and reliable measurement accuracy‌

LI-3000DP supports dual-track inspection and is suitable for use with dual-track placement machines