i-ave ukuya kuthi ga kwi-70% kuMacandelo e-SMT - kwi-Stock & ukulungele ukuThunyelwa
Fumana iQuote →Ukukhangela ngokukhawuleza
Izixhobo zeSemiconductor FAQ
Isixhobo sinokufikelela kwiifom zokupakisha ezahlukeneyo ezifana neengxowa ezisicaba, izikhwama ezintathu-dimensional
Umatshini wokuhlela we-ASM unokuchonga ngokukhawuleza nangokuchanekileyo kwaye uhlele izinto ze-elektroniki.
I-ASM AD832i die bonder iphucula kakhulu impumelelo yemveliso ngokuqhutywa kwayo okusebenzayo kunye nokusebenza okuzenzekelayo
I-die bonder yenzelwe ukuba ibe bhetyebhetye kwaye inokuphatha ii-motherboards zobukhulu obahlukeneyo kunye neemilo
Isixhobo sisebenza ngokuchaneka okuphezulu kwaye sinokufikelela kulawulo oluchanekileyo lwe-±7um@3σ kunye ±1°@3σ.
I-wire bonder yenza kakuhle ekusebenzeni kwexesha elide kwaye inozinzo oluphezulu, olunokuqinisekisa ukuqhubeka nokuthembeka kwenkqubo yokuvelisa.
Ukuchaneka kwe-wire bonder yale ntambo yocingo ifikelela kwi-± 2 microns
I-AB589 ye-wire bonder sisixhobo sokubopha ucingo oluphezulu oluveliswe yi-ASMPT
I-ASMPT AERO CAM series wire bonder yenzelwe ngokukodwa ukupakishwa kwemodyuli yekhamera
I-AD8312 Plus yokubeka i-die bonder idibanisa iingenelo ze-ultra-fast kunye nokubeka
I-AD420XL die bonder yenzelwe ukusebenza kakuhle engqondweni kwaye inokubonelela ngezisombululo ze-high-speed die bonding.
I-ASM die bonder SD8312 ithatha iinkqubo zokulawula eziphambili kunye nezakhiwo zoomatshini
I-coplanarity ye-loop evaliweyo (TTV) ye-ORCAS inkqubo yokubumba ngesandla ingaphantsi kwe-20μm, iqinisekisa iziphumo zokuchaneka okuphezulu.
Ukusika okuphezulu ngokuchanekileyo: I-DFL7341 isebenzisa itekhnoloji yokusika engabonakaliyo ye-laser ukwenza umaleko olungisiweyo kuphela ngaphakathi kwe-silicon wafer.
I-DFD6341 isebenzisa indlela ekhethekileyo yokujikeleza, ukubuya kwesantya se-X axis kunyuswe ukuya kwi-1000 mm / s.
Inkqubo inokusingatha iinkqubo ezininzi ze-chip kunye neenkqubo ezininzi kumatshini omnye
Iimathiriyeli ekrwada eziza kuhlelwa zondliwa kwizibuko lokutya likamatshini wokuhlela ngebhanti lokuhambisa okanye ivibrator.
I-AD280 Plus die bonder ine-high-chane-chane ye-die bonding, enokuqinisekisa ukubekwa okuchanekileyo kwamacandelo.
Isikhululo sophando se-UF3000EX samkela umgaqo-siseko wetshiphu osebenza kakuhle kakhulu kunye nenkqubo yokuqhuba ukuqinisekisa ukusebenza ngesantya esiphezulu nangengxolo ephantsi yeqonga le-X kunye ne-Y.
Umatshini wokuhlola we-AP3000/AP3000e unokufezekisa ukuchaneka okuphezulu, uvavanyo oluphezulu, olufanelekileyo ngakumbi kwiimfuno ezinkulu zemveliso.
I-Geekvalue: Uzalelwe oomatshini bokuKhetha-neNdawo
Inkokeli yesisombululo esinye sokumisa i-chip mounter
Ngathi
Njengomthengisi wezixhobo kushishino lokwenziwa kombane, iGeekvalue ibonelela ngoluhlu loomatshini abatsha nabasele besetyenzisiwe kunye nezixhobo ezisuka kwiibrendi ezaziwayo ngamaxabiso akhuphisana kakhulu.
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