en
ori
alb
amh
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bel
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fil
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gle
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hi
hkm
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id
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kin
kor
lao
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lit
ltz
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mao
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nl
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nya
orm
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I-oven ye-SONIC ye-reflow i-oven ye-soldering ye-teknoloji ye-surface Mount (i-SMT), ifanelekile ngokukodwa kwiimfuno eziphezulu, ezincinci kunye ne-soldering edibeneyo. I-oven ye-SONIC ye-reflow iqaphela uxhulumaniso lomatshini kunye nombane phakathi kweephedi ze-solder zecandelo okanye izikhonkwane kunye neepads zebhodi yesekethe eprintiweyo ngokulungisa i-solder yokunamathisela kwangaphambili isasazwe kwiipadi zebhodi yesekethe eprintiweyo.
Iiparamitha zobugcisa kunye neempawu ezisebenzayo
Iimodeli ezithile zee-ovens ze-SONIC zokugeleza kwakhona, njenge-N10, zineendawo ze-10 zokushisa kunye neendawo zokupholisa ze-2 kunye nenkxaso ye-solder-free soldering. Iimpawu zayo zenkqubo ziquka:
Ulawulo lobushushu: Ngolawulo oluchanekileyo lobushushu, qinisekisa ukufana kweqondo lobushushu ngexesha le-soldering ukuphepha ubushushu kunye nesithunzi.
Indawo engenanto i-oksijeni: Ukubonelela nge-oxygen-free environment ngexesha lokufudumala kwangaphambili kunye ne-soldering ukuqinisekisa umgangatho we-soldering.
Iindleko zokusebenza eziphantsi: Ngexabiso eliphantsi kakhulu lokusebenza kunye nokuguquguquka okuguquguqukayo, ifanelekile kwizicelo ezahlukeneyo ze-SMT, kuquka i-solder-free soldering.
Iimeko zesicelo kunye neenzuzo
Ii-ovens ze-SONIC zokubuyisela kwakhona zisetyenziswa ngokubanzi kwimveliso yeemveliso ezahlukeneyo ze-elektroniki, ngakumbi kwiimeko ezifuna ukuxinana okuphezulu, i-miniaturized kunye ne-solder edibeneyo. Izibonelelo zayo ziquka:
I-welding ephezulu yokusebenza: Iyakwazi ukuhlangabezana neemfuno ze-welding eziphezulu.
Ukuhambelana kobushushu: Ukuhambelana kobushushu obuphezulu kuyo yonke indibano ye-welding ngaphandle kokushisa.
Ukusebenza okuguquguqukayo: Ukuguquguquka okuguquguqukayo kunye nokusebenza ngokuzimeleyo, okufanelekileyo kwizicelo ezahlukeneyo ze-SMT, kubandakanya i-lead-free soldering.
