die cutting machine

mashiinka goynta dhinta

mashiinka goynta dhinta

Mashiinka wax lagu jeexo ee wafer, oo sidoo kale loo yaqaano mashiinka wax lagu gooyo wafer, waa aalad loo isticmaalo in lagu gooyo maraqyada jajabyada gaarka ah. Warshada wafer waa qayb muhiim ah oo ka mid ah habka wax soo saarka semiconductor. Ujeeddadeedu waa in la kala saaro waferrada soo maray geeddi-socodyo badan oo loo beddelo dhimasho badan oo madaxbannaan. Dhimashadani waxay inta badan ka kooban tahay hawlo wareeg ah oo dhamaystiran waana qaybaha asaasiga ah ee loo isticmaalo soo saarista alaabta elektiroonigga ah.

Raadin Degdeg ah

dhiman mashiinka goynta FAQ

  • DISCO Dicing Saw machine DFD6341

    DISCO Dicing Saw mashiinka DFD6341

    DFD6341 waxay isticmaashaa hannaan wareeg oo gaar ah, xawaaraha soo celinta dhidibka X waxa la kordhiyey 1000 mm/s

  • DISCO wafer cutting machine DFL7341

    DISCO mashiinka goynta wafer DFL7341

    goynta saxda ah ee sare: DFL7341 waxay isticmaashaa tignoolajiyada goynta aan la arki karin ee leysarka si ay u sameyso lakab wax laga beddelay oo kaliya gudaha wafer silikoon

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GEEKVALUE

Geekvalue: Wuxuu u dhashay Mashiinnada Qaadista iyo Goobta

Hogaamiye xal hal-joojin ah oo loogu talagalay rakibaha chip

Annaga

Soo-iibiyaha qalabka warshadaha wax-soo-saarka elegtarooniga ah, Geekvalue wuxuu bixiyaa mashiinno cusub oo la isticmaalay iyo qalabyo kala duwan oo ka yimid magacyo caan ah oo qiimahoodu aad u sarreeyey.

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