i-ave ukuya kuthi ga kwi-70% kuMacandelo e-SMT - kwi-Stock & ukulungele ukuThunyelwa

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die cutting machine

kufa umatshini wokusika

kufa umatshini wokusika

Umatshini wokusarha, okwaziwa ngokuba ngumatshini wokudayela osicaba, sisixhobo esisetyenziselwa ukusika iiwafa zibe ziitshiphusi ezizimeleyo. I-Wafer sawing yinxalenye ebalulekileyo yenkqubo yokuvelisa i-semiconductor. Injongo yayo kukwahlula iiwafers eziye zadlula kwiinkqubo ezininzi kwi-multiple ezizimeleyo. Oku kufa kuhlala kuqulathe imisebenzi yesekethe epheleleyo kwaye ngamacandelo aphambili asetyenziselwa ukwenza iimveliso zombane.

EKHAYA>imveliso > Izixhobo zeSemiconductor > kufa umatshini wokusika >

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fa umatshini wokusika FAQ

  • 65% yesaphulelo
    DISCO Dicing Saw machine DFD6341

    DISCO Dicing Saw machine DFD6341

    I-DFD6341 isebenzisa indlela ekhethekileyo yokujikeleza, ukubuya kwesantya se-X axis kunyuswe ukuya kwi-1000 mm / s.

  • 70% yesaphulelo
    DISCO wafer cutting machine DFL7341

    Umatshini wokusika we-DISCO wafer DFL7341

    Ukusika okuphezulu ngokuchanekileyo: I-DFL7341 isebenzisa itekhnoloji yokusika engabonakaliyo ye-laser ukwenza umaleko olungisiweyo kuphela ngaphakathi kwe-silicon wafer.

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