SONIC Reflow Soldering Oven K series

I-oven ye-SONIC ye-reflow i-oven ye-soldering ye-teknoloji ye-surface Mount (i-SMT), ifanelekile ngokukodwa kwiimfuno eziphezulu, ezincinci kunye ne-soldering edibeneyo. I-oven ye-SONIC ye-reflow iqaphela uxhulumaniso lomatshini kunye nombane phakathi kweephedi ze-solder zecandelo okanye izikhonkwane kunye neepads zebhodi yesekethe eprintiweyo ngokulungisa i-solder yokunamathisela kwangaphambili isasazwe kwiipadi zebhodi yesekethe eprintiweyo.

Iiparamitha zobugcisa kunye neempawu ezisebenzayo

Iimodeli ezithile zee-ovens ze-SONIC zokugeleza kwakhona, njenge-N10, zineendawo ze-10 zokushisa kunye neendawo zokupholisa ze-2 kunye nenkxaso ye-solder-free soldering. Iimpawu zayo zenkqubo ziquka:

Ulawulo lobushushu: Ngolawulo oluchanekileyo lobushushu, qinisekisa ukufana kweqondo lobushushu ngexesha le-soldering ukuphepha ubushushu kunye nesithunzi.

Indawo engenanto i-oksijeni: Ukubonelela nge-oxygen-free environment ngexesha lokufudumala kwangaphambili kunye ne-soldering ukuqinisekisa umgangatho we-soldering.

Iindleko zokusebenza eziphantsi: Ngexabiso eliphantsi kakhulu lokusebenza kunye nokuguquguquka okuguquguqukayo, ifanelekile kwizicelo ezahlukeneyo ze-SMT, kuquka i-solder-free soldering.

Iimeko zesicelo kunye neenzuzo

Ii-ovens ze-SONIC zokubuyisela kwakhona zisetyenziswa ngokubanzi kwimveliso yeemveliso ezahlukeneyo ze-elektroniki, ngakumbi kwiimeko ezifuna ukuxinana okuphezulu, i-miniaturized kunye ne-solder edibeneyo. Izibonelelo zayo ziquka:

I-welding ephezulu yokusebenza: Iyakwazi ukuhlangabezana neemfuno ze-welding eziphezulu.

Ukuhambelana kobushushu: Ukuhambelana kobushushu obuphezulu kuyo yonke indibano ye-welding ngaphandle kokushisa.

Ukusebenza okuguquguqukayo: Ukuguquguquka okuguquguqukayo kunye nokusebenza ngokuzimeleyo, okufanelekileyo kwizicelo ezahlukeneyo ze-SMT, kubandakanya i-lead-free soldering.