en
ori
alb
amh
ara
arm
aym
aze
bel
ben
bos
bul
bur
cs
dan
de
div
el
est
fil
fin
fra
gle
glg
grn
heb
hi
hkm
hrv
hu
ice
id
it
jp
kan
kin
kor
lao
lav
lit
ltz
lug
mao
may
mlt
nep
nl
nor
nya
orm
per
pl
pt
rom
ru
san
sk
som
spa
srp
swa
swe
tam
th
tr
ukr
urd
vie
wel
xho
SONIC reflow oven is a soldering equipment for surface mount technology (SMT), especially suitable for high-density, miniaturized and integrated soldering needs. SONIC reflow oven realizes mechanical and electrical connection between surface mounted component solder ends or pins and printed circuit board pads by remelting the paste solder pre-distributed to the printed circuit board pads.
Technical parameters and functional features
Specific models of SONIC reflow ovens, such as N10, have 10 temperature zones plus 2 cooling zones and support lead-free soldering. Its process features include:
Temperature control: Through precise temperature control, ensure temperature uniformity during soldering to avoid overheating and shadowing.
Oxygen-free environment: Provide an oxygen-free environment during preheating and soldering to ensure soldering quality.
Low operating cost: With ultra-low operating cost and flexible versatility, it is suitable for various SMT applications, including lead-free soldering.
Application scenarios and advantages
SONIC reflow ovens are widely used in the production of various electronic products, especially in occasions requiring high-density, miniaturized and integrated soldering. Its advantages include:
High-performance welding: Able to meet high-performance welding requirements.
Temperature consistency: High temperature consistency throughout the entire welding assembly without overheating.
Flexible operation: Flexible versatility and independent operation, suitable for various SMT applications, including lead-free soldering
