Yamaha flip chip bonder YSH20

Ebirungi ebiri mu mmotoka ya Yamaha eya YSH20 die bonder okusinga mulimu bino wammanga:

Obusobozi bw’okuteeka waggulu n’obutuufu obw’amaanyi: YSH20 erina obusobozi bw’okuteeka okutuuka ku 4,500 UPH (0.8 seconds/Unit), nga buno bwe busobozi bw’okuteeka obw’oku ntikko mu byuma ebiteeka flip chip. Obutuufu bwayo obw’okuteeka busobola okutuuka ku ±10μm (3σ), okukakasa nti empeera y’okuteeka mu butuufu obw’amaanyi.

Wide component placement range: Ebyuma bisobola okuteeka ebitundu okuva ku 0.6x0.6mm okutuuka ku 18x18mm, ebisaanira chips n’ebitundu ebya sayizi ez’enjawulo.

Ffoomu z’okugaba ebitundu ebingi: YSH20 ewagira ffoomu z’okugaba ebitundu ebingi, omuli wafers (empeta za yinsi 6, yinsi 8, yinsi 12 ezipapajjo), trays z’omubisi gw’enjuki ne tape trays (obugazi 8, 12, mm 16), nga zituukiriza ebyetaago eby’enjawulo eby’okufulumya.

Ebyetaago by’amaanyi n’ensibuko ya ggaasi: Ebyuma bikozesa amasannyalaze aga phase ssatu, era ekyetaagisa ensibuko ya ggaasi kiri waggulu wa 0.5MPa, okukakasa nti ebyuma bikola bulungi.

Obuwagizi bwa sayizi ya substrate ekyukakyuka: YSH20 esobola okukwata substrates okuva ku L50 x W30 okutuuka ku L340 x W340 mm, era esobola okuwanirira substrates okutuuka ku mm L340 x W340 okusobola okutuukiriza ebyetaago bya substrates eza sayizi ez’enjawulo

Ekyuma ekigaba wafer wa YWF: Ekyuma kino kirimu ekyuma ekigaba wafer ekya YWF, ekiwanirira wafer za yinsi 6, 8, ne 12 era nga kirina omulimu gw’okusasula enkoona ya θ, ekyongera okulongoosa obugonvu n’obutuufu bw’ebyuma