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fil
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gle
glg
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heb
hi
hkm
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id
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kin
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lao
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ltz
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mao
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mlt
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nl
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orm
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pl
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rom
ru
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wel
xho
Uncedo lwe-YSH20 die bonder ye-Yamaha ikakhulu ibandakanya le miba ilandelayo:
Ikhono lokubeka eliphezulu kunye nokuchaneka okuphezulu: i-YSH20 inamandla okubeka ukuya kwi-4,500 UPH (imizuzwana eyi-0.8 / iYunithi), eyona nto iphezulu yokubeka phakathi koomatshini bokubeka i-flip chip. Ukuchaneka kokubeka kwayo kunokufikelela kwi-±10µm (3σ), iqinisekisa isiphumo sokubeka esichanekileyo.
Uluhlu olubanzi lokubeka icandelo: Isixhobo sinokubeka amacandelo ukusuka kwi-0.6x0.6mm ukuya kwi-18x18mm, efanelekileyo kwiichips kunye namacandelo obungakanani obuhlukeneyo.
Iifom zonikezelo lwamacandelo amaninzi: I-YSH20 isekela iifom zokubonelela ngamacandelo amaninzi, kubandakanywa ii-wafers (i-6-intshi, i-8-intshi, i-12-intshi ye-flat rings), iitreyi ze-honeycomb kunye ne-tape trays (ububanzi be-8, 12, 16 mm), ukuhlangabezana neemfuno ezahlukeneyo zokuvelisa.
Amandla anamandla kunye neemfuno zomthombo wegesi: Isixhobo sisebenzisa umbane wesigaba sesithathu, kwaye imfuno yomthombo wegesi ingaphezulu kwe-0.5MPa, iqinisekisa ukusebenza okuzinzile kwezixhobo.
Inkxaso yesayizi ye-substrate eguquguqukayo: I-YSH20 inokusingatha i-substrates ukusuka ku-L50 x W30 ukuya kwi-L340 x W340 mm, kwaye inokuxhasa ukuya kuthi ga kwi-L340 x W340 mm substrates ukuhlangabezana neemfuno ze-substrates zobukhulu obahlukeneyo.
Isixhobo sokubonelela nge-wafer ye-YWF: Isixhobo sixhotyiswe ngesixhobo sokubonelela nge-wafer ye-YWF, exhasa i-6, i-8, kunye ne-12-intshi ye-wafers kwaye inomsebenzi wembuyekezo ye-θ ye-angle, ephucula ngakumbi ukuguquguquka kunye nokuchaneka kwezixhobo.
