The advantages of the Siemens HF3 placement machine mainly include the following aspects:
High precision and stability : The placement accuracy of the Siemens HF3 placement machine is very high, with a standard of ±60 microns, a DCA accuracy of ±55 microns, and an angle accuracy of ±0.7°/(4σ)
. This high precision ensures accurate installation of components and reduces the error rate in production.
Wide applicability : The HF3 is capable of placing components ranging from the smallest 0201 or even 01005 chips to flip chips, CCGAs, and special-shaped components weighing up to 100 grams and measuring 85 x 85/125 x 10mm
. This wide applicability makes the HF3 suitable for the placement needs of a variety of electronic components.
Efficient production capacity : The placement speed of the HF3 can reach 40,000 components per hour, which is suitable for large-scale production needs
. In addition, its material station is 180, the patch head is 3 X-Y axis cantilever, 24 nozzle placement head, 2 large IC nozzle heads, which further improves production efficiency.
Good maintenance: Due to the short use time and good maintenance of Siemens HF3, the equipment has a longer reuse life, higher precision and better stability, which makes HF3 very popular in the second-hand market.
Flexible configuration options: HF3 supports single-track and dual-track configurations. The PCB size range that can be mounted on the single track is 50mm x 50mm to 450mm x 508mm, and the dual track is 50mm x 50mm to 450mm x 250mm
. This flexibility makes HF3 suitable for PCB production needs of different scales
