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Semiconductor equipment

Izixhobo zeSemiconductor - Iphepha3

Umatshini weSemiconductor

Umsebenzi ophambili wezixhobo zokupakisha kukusika kunye nokutywina ii-wafers emva kwemveliso kunye nokusetyenzwa, kwaye emva koko zisetyenzwe zibe ziichips ezigqityiweyo. Inkqubo yokupakisha ibandakanya i-wafer thinning, i-wafer cut, i-chip mounting, i-welding bonding, inkqubo yokutywinwa kweplastiki, inkqubo yokunyanga emva kokunyanga, ukuvavanya, inkqubo yokumakisha (i-electroplating, ukugoba, ukuprintwa kwe-laser), ukupakishwa, ukuhlolwa kwendawo yokugcina impahla, ukuthumela kunye nezinye iinkqubo. Indima yokupakishwa kukukhusela ukusebenza kwetshiphu, ukunciphisa ubunzima bobugcisa, kunye nokuphucula ukusebenza kwemveliso kunye nezinga lesivuno.

EKHAYA>imveliso > Izixhobo zeSemiconductor >

Ukukhangela ngokukhawuleza

Izixhobo zeSemiconductor FAQ

  • asm wire Bonder machine ab550

    asm ucingo Bonder machine ab550

    Uyilo lwebhentshi yokusebenzela yenza i-welding ikhawuleze, ichaneke ngakumbi kwaye izinzile.

  • asm wire Bonding machine Eagle Aero Reel to Reel‌

    i-asm wire Bonding machine Eagle Aero Reel ukuya kwiReel

    Inzwa ibona indawo kunye ne-angle ye-chip okanye i-substrate kwaye idlulisela idatha kwi-generator laser.

  • ASM Laser Cutting Machine LS100-2‌

    ASM Laser Cutting Machine LS100-2

    Iinzuzo ze-ASM laser cutting machine LS100-2 ikakhulu ziquka ukuchaneka okuphezulu, ukusebenza kakuhle kunye nokulungelelanisa okunamandla.

  • ASM laser cutting machine LASER1205

    Umatshini wokusika we-ASM laser LASER1205

    Isantya sokusebenza : Isixhobo sinesantya esihamba ngokukhawuleza se-100m / min.

  • ASM LED packaging machine IDEALab 3G

    Umatshini wokupakisha we-ASM LED IDEALab 3G

    Ukucwangciswa kwebhiya enye: Isixhobo sibonelela ngeendlela ezimbini ezikhethiweyo ze-120T kunye ne-170T, ezifanelekileyo kwiimfuno ezahlukeneyo zemveliso.

  • besi molding line ams-x

    ibe kumgca wokubumba ams-x

    Umatshini wokubumba we-BESI's AMS-X ngumatshini wokubumba we-servo hydraulic ophucukileyo oneengenelo ezininzi kunye neempawu

  • besi molding system MMS-X

    isixokelelwano sokubumba iMMS-X

    Umatshini wokubumba we-BESI we-MMS-X yinguqulelo yesandla yomatshini wokungunda we-AMS-X. Isebenzisa ipleyiti yokushicilela esandula ukuphuhliswa enesakhiwo esibambene ngokugqithisileyo nesiqinileyo ukufumana isiphelo esigqibeleleyo, esingenambane...

  • Fico Molding machine FML

    Umatshini we-Fico wokubumba i-FML

    Umsebenzi we-FML womatshini wokubumba we-BESI usetyenziswa ikakhulu kulawulo oluchanekileyo kunye nolawulo ngexesha lokupakishwa kunye nenkqubo ye-electroplating.

  • Fico Molding line AMS-LM

    Fico Molding umgca AMS-LM

    Umsebenzi ophambili womatshini we-BESI we-AMS-LM kukucubungula ama-substrates amakhulu kunye nokubonelela ngemveliso ephezulu kunye nokusebenza kakuhle kunye nemveliso. Umatshini uyakwazi ukusetyenzwa 102 x 280 mm substrates a

  • fico molding system AMS-i

    inkqubo yokubumba i-fico AMS-i

    I-AMS-i kumatshini wokubumba we-fico yindibano ezenzekelayo kunye nenkqubo yovavanyo eveliswa yi-fico. I-fico yinkampani ye-semiconductor kunye ne-microelectronics yokuvelisa izixhobo ezikomkhulu eNetherlands.

GEEKVALUE

I-Geekvalue: Uzalelwe oomatshini bokuKhetha-neNdawo

Inkokeli yesisombululo esinye sokumisa i-chip mounter

Ngathi

Njengomthengisi wezixhobo kushishino lokwenziwa kombane, iGeekvalue ibonelela ngoluhlu loomatshini abatsha nabasele besetyenzisiwe kunye nezixhobo ezisuka kwiibrendi ezaziwayo ngamaxabiso akhuphisana kakhulu.

© Onke Amalungelo Agciniwe. Inkxaso yobuGcisa:TiaoQingCMS

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