en
ori
alb
amh
ara
arm
aym
aze
bel
ben
bos
bul
bur
cs
dan
de
div
el
est
fil
fin
fra
gle
glg
grn
heb
hi
hkm
hrv
hu
ice
id
it
jp
kan
kin
kor
lao
lav
lit
ltz
lug
mao
may
mlt
nep
nl
nor
nya
orm
per
pl
pt
rom
ru
san
sk
som
spa
srp
swa
swe
tam
th
tr
ukr
urd
vie
wel
xho
BGA solder joints, concealed connections and internal assembly structures cannot be fully evaluated from the outside of a component. The BF-3AXiM110 uses X-ray imaging to reveal internal features, giving inspectors another way to investigate defects that surface-level optical inspection may not expose.
Published third-party listings for this model report a maximum PCB size of 510 × 460 mm and sample-stage travel of 500 × 500 × 200 mm along the X, Y and Z axes. The same listings describe 2D imaging and 3D CT inspection, with an optional rotation configuration. These figures should be checked against the actual machine documentation before being used as purchase specifications.
For CT inspection, sample positioning and rotation capability affect the views available for examining internal structures. Image resolution and scan time also depend on the selected imaging mode and inspection conditions. A specification comparison should therefore distinguish 2D imaging performance from full CT scanning rather than treating them as the same measurement.
SAKI BF-3AXiM110 3D Specifications
| غرض | مواصفة |
|---|---|
| ماركة | SAKI |
| نموذج | BF-3AXiM110 |
| Inspection Method | X-ray imaging; 3D CT capability reported |
| Maximum PCB Size | 510 × 460 mm, reported; confirm |
| Sample-Stage Travel | 500 × 500 × 200 mm, reported; confirm |
| Rotation / Tilt | Confirm installed configuration |
| X-Ray Source | Confirm machine nameplate |
| Image Resolution | Confirm mode-specific specification |
| Power and Safety Requirements | Confirm original equipment documentation |
