product
SAKI BF-3AXiM110 3D X-Ray Inspection for SMT

SAKI BF-3AXiM110 3D X-Ray Inspection for SMT

Inspect hidden BGA solder joints and internal PCB connections with the SAKI BF-3AXiM110 3D X-ray inspection system.

Ebisingawo

BGA solder joints, concealed connections and internal assembly structures cannot be fully evaluated from the outside of a component. The BF-3AXiM110 uses X-ray imaging to reveal internal features, giving inspectors another way to investigate defects that surface-level optical inspection may not expose.

Published third-party listings for this model report a maximum PCB size of 510 × 460 mm and sample-stage travel of 500 × 500 × 200 mm along the X, Y and Z axes. The same listings describe 2D imaging and 3D CT inspection, with an optional rotation configuration. These figures should be checked against the actual machine documentation before being used as purchase specifications.

For CT inspection, sample positioning and rotation capability affect the views available for examining internal structures. Image resolution and scan time also depend on the selected imaging mode and inspection conditions. A specification comparison should therefore distinguish 2D imaging performance from full CT scanning rather than treating them as the same measurement.

SAKI BF-3AXiM110 3D Specifications

EkintuOkunnyonnyola
BulandiSAKI
EkifaananyiBF-3AXiM110
Inspection MethodX-ray imaging; 3D CT capability reported
Maximum PCB Size510 × 460 mm, reported; confirm
Sample-Stage Travel500 × 500 × 200 mm, reported; confirm
Rotation / TiltConfirm installed configuration
X-Ray SourceConfirm machine nameplate
Image ResolutionConfirm mode-specific specification
Power and Safety RequirementsConfirm original equipment documentation

SAKI BF-3AXiM110 3D X-Ray Inspection Machine

Lwaki abantu bangi basalawo okukola ne GeekValue?

Brand yaffe esaasaana okuva mu kibuga okudda mu kirala, era abantu abatabalika bambuuzizza nti, "GeekValue kye ki?" Kisibuka mu kwolesebwa okwangu: okutumbula obuyiiya bw’Abachina nga bakozesa tekinologiya ow’omulembe. Guno mwoyo gwa kika ogw’okulongoosa obutasalako, ogukwese mu kugoberera kwaffe okutasalako okukola buli kantu n’essanyu ery’okusukka ebisuubirwa buli lwe tutuusa. Obukugu buno kumpi obw’okwewaayo n’okwewaayo si kugumiikiriza kwokka kw’abatandisi baffe, wabula n’omusingi n’ebbugumu ly’ekibinja kyaffe. Tusuubira nti ojja kutandikira wano era otuwe omukisa okutondawo obutuukirivu. Tukolere wamu okutondawo ekyamagero ekiddako ekya "zero defect".

Ebisingawo
GEEKVALUE

Geekvalue: Yazaalibwa ku byuma ebilonda n’okuteeka

Omukulembeze w'okugonjoola ensonga emu ku chip mounter

Ebitukwatako

Ng’omugabi w’ebyuma eri abakola ebyuma, Geekvalue ekuwa ebyuma ebipya n’ebikozesebwa n’ebikozesebwa okuva mu bika eby’amaanyi ku bbeeyi evuganya ennyo.

Endagiriro y’okutuukirira:No. 18, oluguudo lw’amakolero mu Shangliao, mu kibuga Shajing, mu Disitulikiti y’e Baoan, Shenzhen, China

Ennamba y’essimu ey’okwebuuza:+86 13823218491

Email:smt-okutunda9@gdxinling.cn

TUKUTUUKAKO

© Eddembe lyonna liri mu buyinza bwaffe. Obuwagizi mu by'ekikugu:TiaoQingCMS

kfweixin

Sikaani okugattako WeChat

Saba Quote