Haqa qabeessa
enen oriori albalb amhamh araara armarm aymaym azeaze belbel benben bosbos bulbul burbur cscs dandan dede divdiv elel estest filfil finfin frafra glegle glgglg grngrn hebheb hihi hkmhkm hrvhrv huhu iceice idid itit jpjp kankan kinkin korkor laolao lavlav litlit ltzltz luglug maomao maymay mltmlt nepnep nlnl nornor nyanya ormorm perper plpl ptpt romrom ruru sansan sksk somsom spaspa srpsrp swaswa sweswe tamtam thth trtr ukrukr urdurd vievie welwel xhoxho
product
MANA>oomisha > SAKI AOI jedhu >
SAKI BF-3AXiM110 3D X-Ray Inspection for SMT

SAKI BF-3AXiM110 3D X-Ray Inspection for SMT

Inspect hidden BGA solder joints and internal PCB connections with the SAKI BF-3AXiM110 3D X-ray inspection system.

Gaaffii Saffisaa Email:smt-sales9@gdxinling.cn
Gadifageenyaan

BGA solder joints, concealed connections and internal assembly structures cannot be fully evaluated from the outside of a component. The BF-3AXiM110 uses X-ray imaging to reveal internal features, giving inspectors another way to investigate defects that surface-level optical inspection may not expose.

Published third-party listings for this model report a maximum PCB size of 510 × 460 mm and sample-stage travel of 500 × 500 × 200 mm along the X, Y and Z axes. The same listings describe 2D imaging and 3D CT inspection, with an optional rotation configuration. These figures should be checked against the actual machine documentation before being used as purchase specifications.

For CT inspection, sample positioning and rotation capability affect the views available for examining internal structures. Image resolution and scan time also depend on the selected imaging mode and inspection conditions. A specification comparison should therefore distinguish 2D imaging performance from full CT scanning rather than treating them as the same measurement.

SAKI BF-3AXiM110 3D Specifications

WantaIspeesifikeeshinii
Maqaa oomishaaSAKI
Adda dureeBF-3AXiM110
Inspection MethodX-ray imaging; 3D CT capability reported
Maximum PCB Size510 × 460 mm, reported; confirm
Sample-Stage Travel500 × 500 × 200 mm, reported; confirm
Rotation / TiltConfirm installed configuration
X-Ray SourceConfirm machine nameplate
Image ResolutionConfirm mode-specific specification
Power and Safety RequirementsConfirm original equipment documentation

SAKI BF-3AXiM110 3D X-Ray Inspection Machine

Barreeffamoota walqabatan gorfaman

Yaadota Walqabatan

Namoonni baay'een maaliif GeekValue wajjin hojjechuu filatu?

Maqaan keenya magaalaa irraa gara magaalaatti babal'achaa jira, namoonni lakkoofsa hin qabne "GeekValue maali?" Mul'ata salphaa irraa madda: kalaqa Chaayinaa teknooloojii ammayyaatiin humneessuu. Kun hafuura maqaa (brand spirit) fooyya’iinsa itti fufiinsa qabuudha, bal’inaan hordofuu keenya kan hin boqonne fi gammachuu geejjibni hunda waliin kan eegamu caaludha. Ogummaa fi of kennuu obsessive jechuun ni danda’ama kun cimina hundeessitoota keenyaa qofa osoo hin taane, hundee fi ho’ina maqaa keenyaati. Asirraa jalqabdee carraa mudaa hin qabne uumuuf akka nuuf kennitu abdii qabna. Dinqii itti aanu "mudaa zeeroo" jedhu uumuuf waliin haa hojjennu.

Gadifageenyaan
GEEKVALUE

Geekvalue: Maashiniiwwan Fudhachuu fi Kaa'uuf Dhalate

Hogganaa furmaata dhaabbata tokkoo chip mounter

Waa'ee Keenya

Akka dhiyeessaa meeshaalee indaastirii omisha elektirooniksii tokkootti, Geekvalue maashiniiwwanii fi meeshaalee gargaarsaa haaraa fi kan itti fayyadaman maqaawwan beekamoo irraa gatii baayyee dorgomaa ta’een dhiyeessa.

Teessoo quunnamtii:Lakk 18, Daandii Industirii Shangliao, Magaalaa Shaajing, Aanaa Baoan, Shenzhen, Chaayinaa

Lakkoofsa bilbilaa marii:+86 13823218491

Imeelii:smt-gurgurtaa9@gdxinling.cn irraa argattu

NU QUNNAMTII

© Mirgi Qopheessaa Seeraan Kan Eegame. Deeggarsa Teeknikaa:TiaoQingCMS

kfweixin

WeChat dabaluudhaaf scan godhaa

Gaaffii Caqasaa