Ebirungi ebiri mu kyuma ekiteeka Siemens HF3 okusinga mulimu bino wammanga:
Obutuufu n’obutebenkevu obw’amaanyi : Obutuufu bw’okuteeka ekyuma ekiteeka Siemens HF3 waggulu nnyo, nga bulina omutindo gwa ±60 microns, DCA accuracy ya ±55 microns, n’obutuufu bw’enkoona bwa ±0.7°/(4σ)
. Obutuufu buno obw’amaanyi bukakasa okuteekebwa obulungi kw’ebitundu era bukendeeza ku muwendo gw’ensobi mu kukola.
Wide applicability : HF3 esobola okuteeka ebitundu okuva ku chips ezisinga obutono 0201 oba wadde 01005 okutuuka ku flip chips, CCGAs, n’ebitundu eby’enjawulo ebizitowa okutuuka ku gram 100 ate nga bipima 85 x 85/125 x 10mm
. Okukozesebwa kuno okugazi kufuula HF3 okutuukagana n’obwetaavu bw’okuteeka ebitundu by’ebyuma eby’enjawulo.
Obusobozi bw’okufulumya obulungi : Sipiidi y’okuteeka HF3 esobola okutuuka ku bitundu 40,000 buli ssaawa, ekituukirawo ku byetaago by’okufulumya ebinene
. Okugatta ku ekyo, siteegi yaayo ey’ebintu eri 180, omutwe gwa patch guli 3 XY axis cantilever, 24 nozzle placement head, 2 large IC nozzle heads, ekyongera okulongoosa obulungi okufulumya.
Okuddaabiriza obulungi: Olw’obudde obutono obw’okukozesa n’okuddaabiriza obulungi Siemens HF3, ebyuma bino biwangaala okuddamu okukozesebwa, obutuufu obw’amaanyi n’okutebenkera obulungi, ekifuula HF3 okwettanirwa ennyo mu katale k’ebintu ebikozesebwa.
Enkola z’okusengeka ezikyukakyuka: HF3 ewagira ensengeka z’olutindo lumu n’ebiri. PCB size range esobola okuteekebwa ku track emu eri 50mm x 50mm okutuuka ku 450mm x 508mm, ate dual track eri 50mm x 50mm okutuuka ku 450mm x 250mm
. Okukyukakyuka kuno kufuula HF3 okubeera ennungi ku byetaago by’okufulumya PCB eby’emitendera egy’enjawulo
