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Izinto eziluncedo kumatshini wokubekwa kwe-Siemens HF3 ikakhulu ziquka le miba ilandelayo:
Ukuchaneka okuphezulu kunye nokuzinza : Ukuchaneka kokubeka umatshini wokubeka we-Siemens HF3 uphezulu kakhulu, kunye nomgangatho we-± 60 microns, ukuchaneka kwe-DCA ye-± 55 microns, kunye nokuchaneka kwe-angle ± 0.7 ° / (4σ)
. Oku kuchaneka okuphezulu kuqinisekisa ukufakwa ngokuchanekileyo kwamacandelo kunye nokunciphisa izinga lempazamo kwimveliso.
Ukusetyenziswa ngokubanzi : I-HF3 iyakwazi ukubeka izinto ukusuka kweyona incinci i-0201 okanye i-01005 chips ukuya kwi-flip chips, ii-CCGAs, kunye nezinto ezinokwakheka okukhethekileyo ezinobunzima ukuya kwi-100 grams kunye nokulinganisa i-85 x 85/125 x 10mm.
. Oku kusebenza ngokubanzi kwenza i-HF3 ilungele iimfuno zokubekwa kwezinto ezahlukeneyo ze-elektroniki.
Umthamo wokuvelisa osebenzayo : Isantya sokubekwa kweHF3 sinokufikelela kumacandelo angama-40,000 ngeyure, elungele iimfuno ezinkulu zemveliso.
. Ukongeza, isitishi saso semathiriyeli siyi-180, intloko yesiziba yi-3 XY axis cantilever, iintloko ze-nozzle ezingama-24, iintloko ezi-2 ezinkulu ze-IC, eziphucula ngakumbi ukusebenza kakuhle kwemveliso.
Ukugcinwa kakuhle: Ngenxa yexesha elifutshane lokusetyenziswa kunye nokugcinwa kakuhle kwe-Siemens HF3, isixhobo sinobomi obude bokusetyenziswa kwakhona, ukuchaneka okuphezulu kunye nokuzinza okungcono, okwenza i-HF3 idume kakhulu kwimarike yesibini.
Iinketho zoqwalaselo oluguquguqukayo: I-HF3 ixhasa umkhondo omnye kunye noqwalaselo lweengoma ezimbini. Uluhlu lwesayizi ye-PCB enokuthi ifakwe kwingoma enye yi-50mm x 50mm ukuya ku-450mm x 508mm, kunye nengoma emibini yi-50mm x 50mm ukuya ku-450mm x 250mm.
. Oku bhetyebhetye kwenza i-HF3 ilungele iimfuno zemveliso ye-PCB yezikali ezahlukeneyo
