Koh Young SPI 8080 esobola okutuuka ku kwekebejja okusinga amangu mu mulimu guno ate ng’ekuuma obutuufu obw’amaanyi

SE600 ye mulembe gwa CyberOptics era nga kitundu ku nkola ya SPI. Egatta obutuufu obw’oku ntikko n’obuweereza obw’omutindo gw’ensi yonna okusobola okuwa omukutu ogw’omutindo ogwa waggulu

KY8030-3 esobola okutuukiriza omutindo gwa sipiidi y’okuzuula 01005 era erina obusobozi bw’okuzuula sipiidi ey’amaanyi

Enkola y’okukebera solder paste eya PARMI 3D HS60 erina sipiidi ennungi ey’okupima n’okusalawo

PARMI HS70 series ekozesa sensor ya speed RSC_6, ekendeeza ku budde bwonna obw’okuzuula

Bentron SPI 7700E ekwata enkola ya 2D+3D, esobola okuwa okuzuula obuwanvu bwa solder paste mu ngeri entuufu okukakasa omutindo gw’okuweta

X/Y axes zombi zirina linear motors, nga zirina obutuufu bw’entambula bwa ±3um okukakasa obutuufu bw’okuzuula.

Ewa okwekebejja okujjuvu okwa 3D, era okusalawo okw’amaaso kuyinza okulondebwa nga 10μm oba 15μm okukakasa ebivudde mu kwekebejja mu butuufu obw’amaanyi.

TR7007Q SII ye kyuma ekikebera okukuba ebitabo mu ngeri ya solder paste ekola obulungi

Awagira resolutions ssatu eza 7μm, 12μm, ne 18μm, ezisaanira ebyetaago by’okukebera solder paste ey’obutuufu obw’amaanyi.

Okuzuula mu ngeri entuufu: Mirtec SPI MS-11e eriko kkamera ya megapikseli 15, esobola okutuuka ku kuzuula mu ngeri entuufu ennyo mu 3D. Okusalawo kwayo okw’obugulumivu kutuuka ku 0.1μm, obutuufu bw’obuwanvu buba 2μm, era ye

VCTA-V850 ye solder paste thickness detector, nga esinga kukozesebwa okuzuula obuwanvu bwa solder paste n’okukakasa omutindo gw’okulongoosa patch.