VCTA-V850 ndi solder phala makulidwe chodziwira, amene makamaka ntchito kudziwa makulidwe a solder phala ndi kuonetsetsa khalidwe la chigamba processing.

Kuzindikira mwatsatanetsatane: Mirtec SPI MS-11e ili ndi kamera ya 15-megapixel, yomwe imatha kuzindikira bwino kwambiri 3D. Kutalika kwake kumafika 0.1μm, kutalika kwake ndi 2μm, ndipo iye

SE600 ndi mtundu wa CyberOptics ndipo ndi gawo la dongosolo la SPI. Zimabweretsa kulondola kwapamwamba kwambiri komanso magwiridwe antchito apamwamba padziko lonse lapansi kuti apereke nsanja yogwira ntchito kwambiri

Koh Young SPI 8080 imatha kuwunika mwachangu kwambiri pamsika ndikusunga zolondola kwambiri.

Imathandizira kusamvana kutatu kwa 7μm, 12μm, ndi 18μm, koyenera pazofunikira zowunikira za solder.

KY8030-3 imatha kukumana ndi liwiro la 01005 kuzindikira ndipo ili ndi kuthekera kozindikira mwachangu

TR7007Q SII ndi zida zowunika zosindikizira zosindikizira za solder phala

Amapereka kuwunika kwathunthu kwa 3D, ndipo mawonekedwe owoneka bwino amatha kusankhidwa ngati 10µm kapena 15µm kuti atsimikizire zotsatira zowunikira kwambiri.

Nkhwangwa zonse za X/Y zili ndi ma motors okhala ndi mizere, zoyenda bwino za ± 3um kuti zitsimikizire kulondola kwa kuzindikira.

Bentron SPI 7700E itengera 2D + 3D aligorivimu, yomwe imatha kuzindikiritsa makulidwe apamwamba kwambiri a solder kuti muwonetsetse kuti kuwotcherera.

Mndandanda wa PARMI HS70 umagwiritsa ntchito sensa ya RSC_6 yothamanga, yomwe imafupikitsa nthawi yonse yodziwika

PARMI 3D HS60 solder paste inspection system ili ndi liwiro labwino komanso kusamvana