VCTA-V850 is a solder paste thickness detector, which is mainly used to detect the thickness of solder paste and ensure the quality of patch processing.

‌High-precision detection‌: Mirtec SPI MS-11e is equipped with a 15-megapixel camera, which can achieve high-precision 3D detection. Its height resolution reaches 0.1μm, height accuracy is 2μm, and he

The SE600 is CyberOptics' flagship model and is part of the SPI system. It brings together the highest accuracy and world-class serviceability to provide a high-performance platform

Koh Young SPI 8080 is able to achieve the fastest inspection in the industry while maintaining high accuracy

Supports three resolutions of 7μm, 12μm, and 18μm, suitable for high-precision solder paste inspection needs.

KY8030-3 can meet the 01005 detection speed standard and has high-speed detection capabilities

TR7007Q SII is a high-performance solder paste printing inspection equipment

Provides full 3D inspection, and the optical resolution can be selected as 10µm or 15µm to ensure high-precision inspection results‌.

Both X/Y axes are equipped with linear motors, with a motion accuracy of ±3um to ensure the accuracy of detection‌.

Bentron SPI 7700E adopts 2D+3D algorithm, which can provide high-precision solder paste thickness detection to ensure welding quality ‌

PARMI HS70 series uses the speed RSC_6 sensor, which shortens the entire detection time

The PARMI 3D HS60 solder paste inspection system has good measurement speed and resolution