‌Mirtec 3D SPI MS-11e

‌The main functions and effects of Mirtec SPI MS-11e include the following aspects:

‌High-precision detection‌: Mirtec SPI MS-11e is equipped with a 15-megapixel camera, which can achieve high-precision 3D detection, with a height resolution of 0.1μm, a height accuracy of 2μm, and a height repeatability of ±1%.

‌Multiple detection functions‌: The device can detect the volume, area, height, XY coordinates, bridge, etc. of solder paste, and can automatically compensate for the bending state of the substrate to ensure accurate detection on curved PCBs.

‌Advanced optical design‌: Mirtec SPI MS-11e adopts dual projection and shadow ripple design to eliminate single light shadows and achieve accurate 3D detection effects. Its telecentric compound lens design ensures constant magnification and no parallax.

‌Real-time data exchange‌: MS-11e has a closed-loop system that can realize real-time communication between printers/mounters, transmit solder paste position information to each other, fundamentally solve the problem of poor solder paste printing, and improve production quality and efficiency‌.

‌Remote control function‌: The device has a built-in Intellisys connection system that supports remote control, reduces manpower consumption, and improves efficiency. When defects occur on the production line, the system can prevent and control them in advance‌.

‌Wide range of applications‌: Mirtec SPI MS-11e is suitable for SMT solder paste defect detection, especially for the electronics manufacturing industry that requires high-precision detection‌

What are the main areas for SMT solder paste thickness tester to detect?

‌SMT solder paste thickness tester mainly detects the following aspects‌:

‌Solder paste thickness‌: The tester can measure the thickness of solder paste printed on the PCB board, including the result records of thickness, average value, highest point and lowest point‌.

‌Area and volume‌: In addition to thickness measurement, the tester can also measure the area and volume of solder paste to help evaluate the distribution of solder paste‌.

‌XY length and width‌: The length and width in the XY direction can be measured to provide more comprehensive dimensional information‌.

‌Cross-section analysis‌: Including height, highest point, cross-sectional area, distance measurement, etc., to help analyze the cross-sectional characteristics of solder paste‌.

‌2D measurement‌: such as distance, rectangle, circle, ellipse, length, width, area, etc., providing detailed data in the two-dimensional plane‌.

‌3D measurement‌: including adjustable height ratio, 3D image full-scale rotation, translation, zoom and other functions, display area translation and zoom, providing detailed information in three-dimensional space‌