Umatshini wokupakisha we-ASM LED IDEALab 3G

Imisebenzi ephambili kunye neendima zomatshini wokupakisha we-ASM IC IDEALab 3G ibandakanya le miba ilandelayo:

Isisombululo esinoxinano oluphezulu: I-IDEALab 3G ifanelekile kuphando kunye nophuhliso kunye nokuveliswa kwesilingo seenkqubo zokubumba ezinikezelweyo zebhiya enye, ukubonelela ngezisombululo zokupakisha eziphezulu kunye nobukhulu be-100mm ububanzi x 300mm ubude.

Ukucwangciswa kwebhiya enye: Isixhobo sibonelela ngeendlela ezimbini ezikhethiweyo ze-120T kunye ne-170T, ezifanelekileyo kwiimfuno ezahlukeneyo zokuvelisa.

Umsebenzi we-SECS GEM: IDEALab 3G inomsebenzi we-SECS GEM, ophucula ukuzenzekelayo kunye nokudibanisa inkqubo yokuvelisa.

Ubuchwephesha bokupakisha obuphezulu: Izixhobo zisekela ubugcisa obuhlukeneyo bokupakisha, njenge-UHD QFP, i-PBGA, i-PoP kunye ne-FCBGA, njl., ifanelekile kwiimfuno ezahlukeneyo zokupakisha.

Iimodyuli ezinokwandiswa: I-IDEALab 3G isekela iimodyuli ezahlukeneyo ezinokwandiswa, ezifana ne-FAM, i-wedge yombane, i-SmartVac kunye ne-SmartVac, njl., Eyandisa ngakumbi ukuguquguquka kunye nokusebenza kwezixhobo.

Ukusetyenziswa kunye nokubaluleka komatshini wokupakisha we-ASM IC kwipakethe ye-semiconductor:

Ukubekwa kweChip: Umatshini wokubekwa kwetshiphu sesinye sezixhobo ezibaluleke kakhulu kwinkqubo yokupakishwa kwe-semiconductor. Ikakhulu inoxanduva lokuthatha iitshiphusi kwi-wafer kwaye uzibeke kwi-substrate, kwaye ubophe iichips kwi-substrate ngeglue yesilivere. Ukuchaneka, isantya, isivuno kunye nokuzinza komatshini wokubekwa kwetshiphu kubalulekile kwinkqubo yokupakisha ephucukileyo.

Itekhnoloji yokupakisha ekwinqanaba eliphezulu: Ngophuhliso lwetekhnoloji ye-semiconductor, itekhnoloji yokupakisha ephezulu efana ne-2D, i-2.5D, kunye ne-3D yokupakisha ngokuthe ngcembe ibe yinto eqhelekileyo. Ezi teknoloji zifezekisa ukudibanisa okuphezulu kunye nokusebenza ngokupakisha iitshiphusi okanye ii-wafers, kwaye izixhobo ezifana ne-IDEALab 3G zidlala indima ebalulekileyo ekusetyenzisweni kobu buchwepheshe.

Umzila weMarike: Ngokuqhubekeka phambili kwetekhnoloji ye-semiconductor, imfuno yezixhobo zokupakisha eziphambili nayo iyanda. Uxinaniso oluphezulu kunye nezixhobo zokupakisha eziphezulu ezifana ne-IDEALab 3G zinethuba elibanzi lokusebenzisa kwimarike.

Iingenelo ze-ASM IC umatshini wokupakisha i-IDEALab 3G ikakhulu ibandakanya le miba ilandelayo: Isisombululo esiphezulu: I-IDEALab 3G inikezela ngesisombululo sokupakisha esiphezulu kunye nobukhulu be-100mm ububanzi x 300mm ubude, esinokuhlangabezana neemfuno zokupakisha okuphezulu. I-Versatility: Izixhobo zisekela ukucwangciswa okuhlukahlukeneyo, kubandakanywa i-120T kunye ne-170T yokucwangciswa komatshini webhiya enye, efanelekileyo kwiimfuno ezahlukeneyo zokuvelisa. Iimpawu zobugcisa obuphezulu: I-IDEALab 3G inomsebenzi we-SECS GEM, ixhasa iinkqubo zokuvelisa ezizenzekelayo nezikrelekrele, kwaye iphucula ukusebenza kakuhle kwemveliso kunye nokuguquguquka.