Imisebenzi ephambili yomatshini wokuhlola intsimbi ye-SMT ibandakanya ukufumanisa iiparitha eziphambili ezifana nobukhulu bokuvula, indawo, i-offset, into yangaphandle, i-burr, i-hole blocking, imingxuma emininzi, imingxuma embalwa kunye noxinzelelo lwe-mesh yensimbi. Le misebenzi yokufumanisa iqinisekisa ukuba i-mesh yensimbi inokufezekisa umphumo olindelekileyo xa ushicilela i-solder paste, ngaloo ndlela iphucula umgangatho wokuvelisa kunye nokusebenza kakuhle kwemveliso yeemveliso zombane.
Imisebenzi ethile
Ubungakanani bokuvula kunye nokufumanisa indawo: Qinisekisa ukuba ukuchaneka kokuvula kunye nommandla we-mesh yensimbi ihlangabezana neemfuno. Ukufunyanwa kwe-offset: Jonga ukuba i-mesh yentsimbi ivaliwe. Ukufunyaniswa kwemiba yangaphandle: Khangela ukuba kukho imiba yangaphandle kumnatha wentsimbi. Ukufunyanwa kweBurr: Jonga ukuba ngaba kukho iibhutsi kwincam yemesh yentsimbi. Ukubonwa kokuthintela: Khangela ukuba i-mesh yensimbi ivaliwe. Ukufunyanwa kwemingxuma ene-Porous kunye nembalwa: Qinisekisa ukuba inani lokuvuleka kwe-mesh yensimbi iyahambelana noyilo. Ukubonwa koxinzelelo: Khangela ukuba ukunyanzeliswa kwe-mesh yensimbi kuphakathi koluhlu olufanelekileyo.
Iiparamitha zobugcisa kunye neemeko zesicelo
Ukulinganisa okuchanekileyo okuphezulu: I-platform ye-marble yokwamkela, isakhiwo se-gantry esipheleleyo, i-grating grating i-rula evaliweyo yokumisa iteknoloji, njl.njl. ukuqinisekisa ukuchaneka komlinganiselo. Uvavanyo olukhawulezayo: itekhnoloji yeGERBER ezimeleyo, inkqubo elula, iskena esipheleleyo sebhodi yokubhabha, isantya sovavanyo olukhawulezayo, uvavanyo olupheleleyo lwebhodi olugqityiweyo kwimizuzu emi-3.
Uvavanyo lweqela kunye nenqanaba: ukuvulwa kobukhulu obuhlukeneyo, iindidi zamacandelo ahlukeneyo, kunye namanqanaba ahlukeneyo, amanqanaba ahlukeneyo okubona iiparitha zisetyenziselwa ukuqinisekisa uvavanyo oluchanekileyo kunye nokuchaneka kwezinto ezichanekileyo.
Isicelo seshishini
Umatshini wokuhlola umnatha wensimbi we-SMT usetyenziswa kakhulu kwishishini lokuvelisa i-electronics, ngakumbi kwinkqubo ye-SMT, ukufumanisa umgangatho we-mesh yensimbi kunye nokuqinisekisa umgangatho we-solder paste eprintiweyo, ngaloo ndlela ukunciphisa iziphene kwinkqubo yokuvelisa kunye nokuphucula ukuthembeka kwemveliso kunye nokusebenza kakuhle kwemveliso.