Ukukhangela ngokukhawuleza
SAKI AOI FAQ
I-SAKI 3Si-MS2 sisizukulwana esitsha se-3D yenkqubo yokuhlola i-solder paste (SPI) esungulwe ngu-SAKI. Yamkela itekhnoloji yokulinganisa i-multi-spectral kwaye yenzelwe ukuhambelana nomgangatho ...
I-SAKI 3Si-LS2 sisixhobo sokuhlola ukuncamathisela kwe-3D ephucukileyo (SPI) esebenzisa itekhnoloji yelaser triangulation kwaye iyilelwe inkqubo yoshicilelo lwenkqubo yoshicilelo oluchanekileyo.
I-SAKI BF-TristarⅡ sisizukulwana esitsha se-2D yenkqubo yokuhlola okuzenzekelayo (AOI) eyasungulwa ngu-SAKI, eyilelwe ukuhlolwa kwendibano yePCB echanekileyo.
I-SAKI BF-LU1 sisixhobo sokuhlola esisebenza kakuhle esinamacala amabini (AOI) esinikezelwe kuhlolo lomgangatho wePCB (ibhodi yesekethe eprintiweyo) kwi-SMT.
I-SAKI 3Di-LS3 sisixhobo sokuhlola i-3D esisebenza ngokuphezulu esizenzekelayo (i-AOI) eyenzelwe ushishino lokuvelisa i-elektroniki ukuze ibone iziphene ze-welding.
I-SAKI 3Di MS2 iye yaba sisixhobo esibalulekileyo sokulawula umgangatho kwimigca yemveliso ye-SMT yangoku kunye nokuchaneka kwayo okuphezulu kwe-3D + i-algorithm yobukrelekrele ye-AI.
I-SAKI 3Di MD2 sisixhobo sokuhlola okuzenzekelayo se-3D esisebenza ngokukhawuleza (AOI) esasungulwa ngu-SAKI waseJapan. Yenzelwe ukwenziwa kwe-elektroniki yale mihla kwaye isetyenziselwa ukuhlolwa komgangatho ophezulu...
I-SAKI 3Si-LS3EX yinkqubo yokuhlola i-solder paste yamva nje ye-3D (SPI) esungulwe ngu-SAKI waseJapan. Yamkela itekhnoloji yokucinga ye-multi-spectral confocal
I-SAKI BF-3Si-L2 yinkqubo yokuhlola i-solder ye-3D echanekileyo ephezulu (SPI) esungulwe ngu-SAKI waseJapan, eyilelwe ngokukodwa ukulawula umgangatho wenkqubo yokushicilela i-solder paste...
I-BF-3AXiM200 ichaza kwakhona imigangatho yoshishino ngokusebenzisa iimpumelelo ezintathu ezinkulu zetekhnoloji: Ukwenziwa komfanekiso omtsha: Ujoliso lweNano + umtshini wokubala wefoton ukufezekisa ukuchongwa kwenqanaba le-submicron.
I-SAKI BF-10D sisizukulwana esitsha se-2D esizenzekelayo sokuhlola izixhobo (AOI) esaphehlelelwa yi-SAKI Co., Ltd. yaseJapan.
I-SAKI 2D AOI BF-Planet-XII sisixhobo sokuhlola esizenzekelayo esizenzekelayo (AOI) esiphuhliswe ngu-SAKI waseJapan.
I-SAKI 3Di-MS3 sisizukulwana esitsha se-3D yokuhlola okuzenzekelayo (i-AOI) izixhobo, eyenzelwe ukuhlolwa kwe-PCB ephezulu echanekileyo (PCBA).
I-SAKI 3Di-LS3EX sisixhobo esiphezulu sokuhlola okuzenzekelayo kwe-3D (i-AOI) eyenzelwe i-solder joints, ukubekwa kwecandelo kunye nokufunyanwa kwesiphako se-PCB assembly (PCBA)
I-SAKI X-RAY BF-3AXiM110 yinkqubo yokuhlola ezenzekelayo yeX-reyi esebenza ngokuphezulu eyenzelwe iimfuno zokuhlolwa kwebhodi yePCB kushishino lokwenziwa kombane.
I-Geekvalue: Uzalelwe oomatshini bokuKhetha-neNdawo
Inkokeli yesisombululo esinye sokumisa i-chip mounter
Ngathi
Njengomthengisi wezixhobo kushishino lokwenziwa kombane, iGeekvalue ibonelela ngoluhlu loomatshini abatsha nabasele besetyenzisiwe kunye nezixhobo ezisuka kwiibrendi ezaziwayo ngamaxabiso akhuphisana kakhulu.
imveliso
SAKI AOI umatshini wesmt Izixhobo zeSemiconductor umatshini wepcb Umatshini wokulebula ezinye izixhoboIsisombululo somgca we-SMT
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