SAKI 3Di-MS3 SMT 3D umatshini AOI

I-SAKI 3Di-MS3 sisizukulwana esitsha se-3D yokuhlola okuzenzekelayo (i-AOI) izixhobo, eyenzelwe ukuhlolwa kwe-PCB ephezulu echanekileyo (PCBA). Isixhobo sisebenzisa i-multi-spectral imaging + i-3D iteknoloji yokuskena i-laser, idibaniswe ne-AI enzulu yokufunda i-algorithms, ukufumanisa ngokuchanekileyo umgangatho we-welding yeepakethe ezinzima ezifana ne-01005 i-ultra-small components, i-BGA, i-QFN, i-CSP, njl., ukuhlangabezana neemfuno zamashishini athembekileyo aphezulu afana ne-automotive electronics, izixhobo ze-aerospace, izixhobo zonyango.

2. Iinkcukacha ezingundoqo

1. Inkqubo yokubona i-Optical

Iinkcazo zeeParameters

Ukufunyanwa kweTekhnoloji ye-3D ye-Laser Triangulation + i-Multi-angle Color Imaging

Esona sigqibo siphezulu 16MP (4928×3264 iiPixels)

Ubuncinci beCandelo elinokubonwa 008004 Package (0.25×0.125mm)

Ukuchaneka koMlinganiso we-Z ±3μm

Isantya sokubona ≤0.3 Imizuzwana/iNdawo yokuFumana

ISistim yoMthombo wokuKhanya eLungiselekayo i-Multi-angle RGB-IR Hybrid Hybrid Source

2. Ukusebenza koomatshini

Iinkcazo zeeParameters

Ubungakanani obukhulu bePCB 610mm×510mm (ukhetho ukuya kuthi ga kwi-800mm)

Ukuchaneka kokuma kwenqanaba ±3μm

iMotion System Linear Motor Drive + Air Bearing

Uluhlu loLungiso lwe-Z-axis 0-60mm (Ujoliso oluzenzekelayo)

3. Inkqubo yesoftware ekrelekrele

I-algorithm yokufumanisa: Inethiwekhi ye-CNN ye-neural ye-neural + ukubhaqwa komthetho wemveli

Izinto zokuchongwa:

Iziphene zesolder (iindawo zokuthengisela zobuxoki/iisekethe ezimfutshane/itoti engonelanga)

Iziphene zecandelo (iindawo ezilahlekileyo / iindawo ezingalunganga / i-offset / amatye engcwaba)

Umlinganiselo we-3D morphology (i-coplanarity/ivolumu yokuncamathisela ye-solder)

Ujongano lwedatha: inkxaso ye-SECS/GEM, i-MES docking

Ingxelo yemveliso: PDF/Excel/custom format

4. Iimfuno zokusingqongileyo

Iimfuno zeeParameters

Ubushushu bokusebenza 18-26°C (ingcebiso rhoqo lobushushu)

Uluhlu lokufuma 40-60%RH

Iimfuno zamandla 220V±5%/50Hz/3kVA

Umoya ocinezelweyo 0.5MPa (ucocekile kwaye womile)

Ubunzima besixhobo Malunga ne-1500kg

III. Iimpawu eziphambili zokusetyenziswa

1. Amanqaku aphambili okusebenza ngokukhuselekileyo

Ukhuseleko lweLaser: Sukujonga ngqo kwi-laser beam (iClass 2M laser)

Ukukhuselwa kwezemidlalo: Uvavanyo lweqhosha lokuyeka ngokukhawuleza ubuncinane kanye ngeveki

Ukukhuselwa kombane omileyo: Nxiba i-anti-static bracelet xa ubamba iPCB

2. Inkqubo yokusebenza esemgangathweni

Inkqubo yokuqalisa:

Vula amandla aphambili → Qala ikhompyuter yeshishini → Qalisa isixokelelwano sentshukumo (malunga nemizuzwana engama-90)

Yenza ulungelelwaniso lwemihla ngemihla (kubandakanywa: ukulinganisa i-optical calibration/height reference calibration)

Ukulungiselela uvavanyo:

Ukubekwa kwePCB kufuna ukusetyenziswa kwezinto ezikhethekileyo (ukunyamezelana ±0.1mm)

Imifuziselo emitsha kufuneka iseke ithala leencwadi lecandelo le-3D (kuyacetyiswa ukuba kuqokelelwe ≥5 iisampulu)

Ufezekiso lweparamitha:

Kumacandelo abonakalisa kakhulu (afana ne-QFN), ubhaqo lwe-multi-spectral fusion kufuneka luvulwe

Kwizixhobo ezixineneyo, kuyacetyiswa ukuba usebenzise isicwangciso sendawo sokuskena

3. Inkqubo yogcino

Umjikelo woLondolozo lwezinto ezisemgangathweni

Ukucoca ifestile yemihla ngemihla ye-Optical Sebenzisa ilaphu elikhethekileyo elingenathuli + isicoci samehlo

Weekly Guide kaloliwe ukuthanjiswa kunye nokugcinwa Sebenzisa NSK LGHP2 igrisi

Ngenyanga Ukubonwa kwamandla eLaser Izinga lokuhoywa ≤5%/ngonyaka

Ulungelelwaniso olupheleleyo lwekota Sebenzisa ibhodi esemgangathweni eqinisekisiweyo ye-NIST

IV. Izisombululo eziqhelekileyo zokusombulula ingxaki

1. Ukusilela kwenkqubo yomatshini

Isiganeko sokusilela: ingxolo engaqhelekanga/ukutenxa kwindawo yentshukumo yeqonga

Unobangela onokwenzeka:

Ukunganeli kokuthanjiswa kwesiporo sikaloliwe

Usulelo lweKhowudi

Servo motor overheating

Isisombululo:

Inkqubo yokusilela ukuphatha

1. Yenza inkqubo yokuthambisa ngesandla

2. Coca isifaki khowudi nge-ethanol engenamanzi

3. Jonga imeko yokusebenza kwefeni yokupholisa

4. Yenza ulungelelwaniso lwembuyekezo yegridi

2. Ukungaphumeleli kwenkqubo yamehlo

Imeko yokusilela: Ukungaqheleki kwedatha yelifu ye-3D

Amanyathelo oxilongo:

Jonga umbane wombane welaser (24V±0.5V)

Qinisekisa ixabiso lomlinganiselo webhodi yolungelelaniso

Jonga uphazamiseko lokukhanya kwendawo

Amanyathelo kaxakeka:

Vula okwexeshana imowudi yobhaqo ye-2D

Lungisa amandla e-laser (uluhlu lwama-80-120%)

V. Izakhono zesicelo esiphezulu

1. Ukuphucula ukufumanisa izinto ezikhethekileyo

Inkqutyana yeCeramic: Yenza ukubonwa kwebhendi ye-infrared (imodyuli ekhethwayo ye-IR iyafuneka)

I-PCB eguquguqukayo: Sebenzisa imowudi yokuskena ecandekileyo (ukunciphisa uxinzelelo kumatshini)

2. Ukuphucula ukusebenza kakuhle kokubona

Itekhnoloji yokuqhubela phambili ehambelanayo:

Umzekelo wokuphucula

Imowudi yesiNtu: Ukubona ngokulandelelana → imizuzwana eyi-0.5/inqaku

Imowudi yokuphucula: Ukuhambelana kommandla → imizuzwana eyi-0.2/inqaku

Isicwangciso sokuhlola esikrelekrele: ukunciphisa ngokuzenzekelayo ukuxinana kokuhlolwa kweendawo ezivavanyiweyo.

VI. Inkqubo yenkxaso yobugcisa

Ukuxilongwa okude: inkxaso ye-VPN yoqhagamshelo lwexesha lokwenyani (ifuna ukufayila kwangaphambili)

Umjikelo wokutshintshwa kwamalungu asetyenzisiweyo:

ILaser: ≥20,000 iiyure

Ikhamera yoshishino: ≥50,000 iiyure

Inkonzo yohlengahlengiso: Kuyacetyiswa ukuba kulungiswe umzi-mveliso wokuqala kanye ngonyaka