SAKI 3Di-MS3 waa jiil cusub oo 3D ah qalabka kormeerka indhaha ee tooska ah (AOI), oo loogu talagalay kormeerka PCB-ga ee saxda ah (PCBA). Qalabku wuxuu adeegsadaa tikniyoolajiyadda sawir-qaadista ee kala-duwan ee 3D, oo ay weheliso algorithms-barashada qoto dheer ee AI, si loo ogaado tayada alxanka ee xirmooyinka adag sida 01005 qaybaha aadka u yaryar, BGA, QFN, CSP, iwm.
2. Tilmaamaha Muhiimka ah
1. Nidaamka ogaanshaha indhaha
Tilmaamaha Halbeegyada
Tignoolajiyada Ogaanshaha 3D Laser Saddex-xagalka + Sawirka Midabka Xaglaha Badan
Qaraarka ugu sarreeya 16MP (4928×3264 Pixels)
Xirmada 008004 ee ugu yar ee la ogaan karo (0.25×0.125mm)
Saxnaanta cabbirka dhidibka-Z ± 3μm
Xawaaraha ogaanshaha ≤0.3 ilbidhiqsi/barta lagu ogaanayo
Nidaamka Isha Iftiinka ee La Baran-garayn karo
2. Waxqabadka Makaanikada
Tilmaamaha Halbeegyada
Cabbirka ugu badan ee PCB 610mm×510mm (ikhtiyaar ah ilaa 800mm)
Saxnaanta Meelaynta Marxaladda ± 3μm
Nidaamka Dhaqdhaqaaqa Matoorka Tooska ah + Qaadista Hawada
Qiyaasta Hagaajinta dhidibka Z-0-60mm (Autofocus)
3. Nidaamka software ee sirdoonka
Ogaanshaha Algorithm: CNN convolutional neural network + ogaanshaha xeer dhaqameed
Waxyaabaha lagu ogaado:
Cilladaha dhibcaha alxanka (kala-goysyada alxanka beenta ah / wareegyada gaaban / daasadaha aan ku filnayn)
Cilladaha ka kooban (qayb maqan/qayb khaldan/qaldan/dhagaxa xabaasha)
Qiyaasta qaab-dhismeedka 3D (mugga koollada koollada)
Interface xogta: taageer SECS/GEM, MES docking
Soo saarista warbixinta: PDF/Excel/qaabka gaarka ah
4. Shuruudaha deegaanka
Shuruudaha Halbeegyada
Heerkulka shaqada 18-26°C (talinta heerkulka joogtada ah)
Qoyaanka wuxuu u dhexeeyaa 40-60% RH
Shuruudaha awoodda 220V± 5%/50Hz/3kVA
Hawo cufan 0.5MPa (nadiif iyo qalalan)
Miisaanka qalabka Qiyaastii 1500kg
III. Tilmaamaha isticmaalka muhiimka ah
1. Qodobbada muhiimka ah ee hawlgal ammaan ah
Badbaadada Laser: Toos ha u eegin laydhka laysarka (Laser Class 2M)
Ilaalinta ciyaaraha: Baadhitaanka badhanka joogsiga degdega ah ugu yaraan hal mar todobaadkii
Ilaalinta korantada taagan: Xidho jijin-joojin ka-hortagga marka aad taabato PCB
2. Habka hawlgalka ee la jaanqaaday
Habka bilowga:
Daar korontada ugu weyn → Bilow kombiyuutarka warshadaha → Bilow habka dhaqdhaqaaqa (qiyaastii 90 ilbiriqsi)
Samee jaangooyeynta maalinlaha ah (ay ku jirto: cabbiridda tixraaca cabbirka indhaha)
Diyaarinta tijaabada:
Meelaynta PCB waxay u baahan tahay isticmaalka qalab gaar ah (dulqaad ± 0.1mm)
Moodooyinka cusub waxay u baahan yihiin inay dhisaan maktabad ka kooban 3D (waxaa lagu talinayaa in la ururiyo ≥5 muunado)
Hagaajinta cabbirka:
Qaybaha aadka u milicsan (sida QFN), ogaanshaha fiyuuska kala duwan ayaa loo baahan yahay in la hawlgeliyo
Aaladaha cufan ee cufan, waxaa lagu talinayaa in la isticmaalo istaraatiijiyad iskaanka deegaanka
3. Nidaamka dayactirka
Alaabta Dayactirka Wareega Heerka
Nadiifinta daaqadaha indhaha ee maalinlaha ah Isticmaal maro gaar ah oo aan boodh lahayn + nadiifiyaha indhaha
Sifeynta iyo dayactirka Hagaha toddobaadlaha ah Isticmaal dufan NSK LGHP2
Ogaanshaha koronta laser-ka ee billaha ah Heerka hoos u dhaca ≤5% / sannadkii
Saxeexinta saxda ah ee rubuc-biloodlaha ah Isticmaal guddiga NIST ee shahaadiga ah
IV. Xalalka cilad-raadinta ee caadiga ah
1. Nidaamka makaanigga oo guuldarraystay
Ifafaalaha fashilka: qaylada aan caadiga ahayn/meelaynta leexinta dhaqdhaqaaqa marxaladda
Sababaha suurtagalka ah:
Saliid aan ku filnayn ee tareenka hagaha
Wasakhda codeeyaha
Servo motor kululaynta
Xalka:
Habka maaraynta fashilantay
1. Samee habka saliidaynta gacanta
2. Ku nadiifi encoder-ka ethanol anhydrous
3. Hubi heerka uu ku shaqaynayo marawaxada qaboojinta
4. Samee jaangooynta magdhowga shabakada
2. Hababka indhaha oo fashilma
Ifafaalaha fashilka: 3D dhibicda xogta daruuriga ah ee aan caadiga ahayn
Tallaabooyinka ogaanshaha:
Hubi korantada korontada laysarka (24V± 0.5V)
Xaqiiji qiimaha cabbiraadda looxa
Hubi faragelinta iftiinka nalka
Tallaabooyinka degdegga ah:
Si ku meel gaadh ah u suurta geli qaabka ogaanshaha 2D
Hagaaji awooda laysarka (80-120% kala duwan)
V. Xirfadaha codsiga sare
1. Hagaajinta ogaanshaha walxaha gaarka ah
Substrate dhoobada: Daree ogaanshaha band infrared (module IR ikhtiyaar ah ayaa loo baahan yahay)
PCB dabacsan: Isticmaal qaabka iskaanka oo qaybsan (yareeya diiqada farsamada)
2. Hagaajinta waxtarka ogaanshaha
Farsamada farsamaynta isbarbar-dhigga:
Tusaalaha hagaajinta
Qaab dhaqameed: Ogaanshaha isku xigxiga → 0.5 ilbiriqsi/dhibic
Qaabka wanaajinta: Isbarbar yaaca gobolka → 0.2 sekan/dhibic
Istaraatiijiyada kormeerka boodboodka ee caqliga leh: si toos ah u yareeya cufnaanta kormeerka meelaha la tijaabiyay
VI. Nidaamka taageerada farsamada
Cilad-sheegid fog: taageer isku xirka VPN-waqtiga-dhabta ah (waxay u baahan tahay gudbin horudhac ah)
Wareegga beddelka qaybaha tafaariiqda:
Laser: ≥20,000 saacadood
Kamarada warshadaha: ≥50,000 saacadood
Adeegga qalin-jabinta: Waxaa lagu talinayaa in la habeeyo warshaddii asalka ahayd sannadkii hal mar