SAKI 3Di-MS3 SMT 3D AOI imashini

SAKI 3Di-MS3 ni igisekuru gishya cyibikoresho bya 3D byikora bya optique (AOI), bigenewe igenzura ryuzuye rya PCB (PCBA). Ibikoresho bifashisha amashusho menshi yerekana amashusho + 3D ya laser yogusikana, hamwe na AI yiga algorithms yimbitse, kugirango tumenye neza ubwiza bwo gusudira bwibikoresho bipfunyitse nka 01005 ultra-small components, BGA, QFN, CSP, nibindi, byujuje ibyifuzo byinganda zizewe cyane nka elegitoroniki yimodoka, ibikoresho byubuvuzi, nindege.

2. Ibyingenzi

1. Sisitemu yo Kumenya neza

Ibipimo Ibisobanuro

Gutahura Ikoranabuhanga rya 3D Laser Triangulation + Amashusho menshi y'amabara

Icyemezo cyo hejuru 16MP (4928 × 3264 Pixel)

Ikintu ntarengwa gishobora kugaragara 008004 Ipaki (0.25 × 0.125mm)

Ibipimo bya Z-axis ± 3μm

Umuvuduko wo Kumenya ≤0.3 Amasegonda / Ingingo yo Kumenya

Sisitemu Yumucyo Sisitemu Yateganijwe Multi-angle RGB-IR Hybrid Umucyo Inkomoko

2. Imikorere ya mashini

Ibipimo Ibisobanuro

Ingano ya PCB ntarengwa 610mm × 510mm (bidashoboka kugeza 800mm)

Icyiciro cya Sitasiyo Yukuri ± 3μm

Sisitemu Yimodoka Yumurongo wa moteri + gutwara ikirere

Z-axis Igipimo cyo Guhindura 0-60mm (Autofocus)

3. Sisitemu yubwenge

Kumenya algorithm: CNN ihindura imiyoboro ya neural net + gakondo gakondo

Ibintu byo gutahura:

Inenge ya Solder inenge (kugurisha ibinyoma / imiyoboro migufi / amabati adahagije)

Inenge yibigize (ibice byabuze / ibice bitari byo / offset / amabuye)

Ibipimo bya 3D morphologie (coplanarity / kugurisha paste ingano)

Imigaragarire yamakuru: shyigikira SECS / GEM, dock ya MES

Raporo yasohotse: PDF / Excel / imiterere yihariye

4. Ibisabwa ku bidukikije

Ibipimo Ibisabwa

Ubushyuhe bwakazi 18-26 ° C (guhorana ubushyuhe burigihe)

Ubushuhe buri hagati ya 40-60% RH

Ibisabwa ingufu 220V ± 5% / 50Hz / 3kVA

Umwuka ucanye 0.5MPa (usukuye kandi wumye)

Uburemere bwibikoresho Hafi 1500 kg

III. Ibyingenzi bikoreshwa

1. Ingingo z'ingenzi zo gukora neza

Umutekano wa Laser: Ntukarebe neza urumuri rwa lazeri (Icyiciro cya 2M laser)

Kurinda siporo: Ikizamini cyo guhagarika byihutirwa byibura rimwe mu cyumweru

Kurinda amashanyarazi ahamye: Wambare igikomo kirwanya static mugihe ukora kuri PCB

2. Igikorwa gisanzwe

Uburyo bwo gutangira:

Fungura imbaraga nyamukuru → Tangira mudasobwa yinganda → Gutangiza sisitemu yo kugenda (amasegonda 90)

Kora kalibrasi ya buri munsi (harimo: kalibrasi ya optique / uburebure bwerekana)

Gutegura ikizamini:

Umwanya wa PCB bisaba gukoresha ibikoresho bidasanzwe (kwihanganira ± 0.1mm)

Moderi nshya igomba gushiraho isomero ryibigize 3D (birasabwa gukusanya ≥5 sample)

Gutezimbere ibipimo:

Kubintu byerekana cyane (nka QFN), gushakisha ibintu byinshi bigomba gukoreshwa

Kubikoresho bifunze cyane, birasabwa gukoresha ingamba zo gusikana

3. Sisitemu yo gufata neza

Ibikoresho byo Kuzenguruka Ibisanzwe

Idirishya rya buri munsi rya Optical Koresha imyenda idasanzwe idafite ivumbi + isuku ya optique

Icyumweru Kuyobora gari ya moshi no kuyitaho Koresha amavuta ya NSK LGHP2

Buri kwezi Laser power detection Igipimo cyo Kwiyongera ≤5% / umwaka

Igihembwe Cyuzuye Kugenzura neza Koresha NIST yemewe ikibaho gisanzwe

IV. Ibisubizo bisanzwe byo gukemura ibibazo

1. Kunanirwa kwa sisitemu ya mashini

Kunanirwa ibintu: urusaku rudasanzwe / gutandukanya umwanya wa stage

Impamvu zishoboka:

Amavuta adahagije yo kuyobora gari ya moshi

Encoder yanduye

Ubushuhe bwa moteri ya Servo

Igisubizo:

Uburyo bwo kunanirwa

1. Kora uburyo bwo gusiga amavuta

2. Sukura kodegisi hamwe na Ethanol idafite ingufu

3. Reba uko imikorere yumufana ukonje

4. Kora indangagaciro ya grid

2. Kunanirwa kwa sisitemu nziza

Kunanirwa ibintu: 3D point yibicu amakuru adasanzwe

Intambwe zo gusuzuma:

Reba amashanyarazi ya lazeri (24V ± 0.5V)

Kugenzura ibipimo byo gupima agaciro

Reba urumuri rutabangamiye

Ingamba zihutirwa:

Gushoboza by'agateganyo uburyo bwa 2D bwo kumenya

Hindura imbaraga za laser (intera 80-120%)

V. Ubuhanga buhanitse bwo gusaba

1. Gukwirakwiza ibikoresho byihariye byo gutahura

Ceramic substrate: Gushoboza infrarafarike ya bande (module ya IR isabwa)

PCB ihindagurika: Koresha uburyo bwo gusikana igice (kugabanya imihangayiko)

2. Kunoza imikorere yo gutahura

Ikoreshwa rya tekinoroji itunganijwe:

Urugero rwiza

Uburyo gakondo: Kumenyekanisha bikurikiranye seconds amasegonda 0.5 / ingingo

Uburyo bwa Optimisation: Kuringaniza akarere → amasegonda 0.2 / ingingo

Ubwenge bwo gusimbuka bwubwenge ingamba: guhita ugabanya ubwinshi bwubugenzuzi bwibice byapimwe byujujwe

VI. Sisitemu yo gushyigikira tekinike

Kwipimisha kure: shyigikira VPN igihe-nyacyo (bisaba kubanza gutanga)

Ibice bisimburwa byizunguruka:

Lazeri: amasaha 20.000

Kamera yinganda: amasaha 50.000

Serivise ya Calibration: Birasabwa guhinduranya uruganda rwumwimerere rimwe mumwaka