SAKI 3Di-MS3 smt 3D AOI machine

SAKI 3Di-MS3 is a new generation of 3D automatic optical inspection (AOI) equipment, designed for high-precision PCB assembly (PCBA) inspection. The equipment uses multi-spectral imaging + 3D laser scanning technology, combined with AI deep learning algorithms, to accurately detect the welding quality of complex packages such as 01005 ultra-small components, BGA, QFN, CSP, etc., meeting the needs of high-reliability industries such as automotive electronics, medical equipment, and aerospace.

2. Core Specifications

1. Optical Detection System

Parameters Specifications

Detection Technology 3D Laser Triangulation + Multi-angle Color Imaging

Highest Resolution 16MP (4928×3264 Pixels)

Minimum Detectable Component 008004 Package (0.25×0.125mm)

Z-axis Measurement Accuracy ±3μm

Detection Speed ≤0.3 Seconds/Detection Point

Light Source System Programmable Multi-angle RGB-IR Hybrid Light Source

2. Mechanical Performance

Parameters Specifications

Maximum PCB Size 610mm×510mm (optional up to 800mm)

Stage Positioning Accuracy ±3μm

Motion System Linear Motor Drive + Air Bearing

Z-axis Adjustment Range 0-60mm (Autofocus)

3. Intelligent software system

Detection algorithm: CNN convolutional neural network + traditional rule detection

Detection items:

Solder point defects (false solder joints/short circuits/insufficient tin)

Component defects (missing parts/wrong parts/offset/tombstones)

3D morphology measurement (coplanarity/solder paste volume)

Data interface: support SECS/GEM, MES docking

Report output: PDF/Excel/custom format

4. Environmental requirements

Parameters Requirements

Working temperature 18-26°C (constant temperature recommendation)

Humidity range 40-60%RH

Power requirements 220V±5%/50Hz/3kVA

Compressed air 0.5MPa (clean and dry)

Equipment weight About 1500kg

III. Key usage specifications

1. Key points for safe operation

Laser safety: Do not look directly into the laser beam (Class 2M laser)

Sports protection: Emergency stop button test at least once a week

Static electricity protection: Wear an anti-static bracelet when touching PCB

2. Standardized operation process

Startup procedure:

Turn on the main power → Start the industrial computer → Initialize the motion system (about 90 seconds)

Perform daily calibration (including: optical calibration/height reference calibration)

Test preparation:

PCB positioning requires the use of special fixtures (tolerance ±0.1mm)

New models need to establish a 3D component library (it is recommended to collect ≥5 samples)

Parameter optimization:

For highly reflective components (such as QFN), multi-spectral fusion detection needs to be enabled

For densely pinned devices, it is recommended to use a local scanning strategy

3. Maintenance system

Cycle Maintenance items Standard

Daily Optical window cleaning Use a special dust-free cloth + optical cleaner

Weekly Guide rail lubrication and maintenance Use NSK LGHP2 grease

Monthly Laser power detection Attenuation rate ≤5%/year

Quarterly Comprehensive precision calibration Use NIST certified standard board

IV. Typical troubleshooting solutions

1. Mechanical system failure

Failure phenomenon: abnormal noise/positioning deviation of the stage movement

Possible causes:

Insufficient lubrication of the guide rail

Encoder contamination

Servo motor overheating

Solution:

Failure handling process

1. Perform manual lubrication procedure

2. Clean the encoder with anhydrous ethanol

3. Check the operating status of the cooling fan

4. Perform grid compensation calibration

2. Optical system failure

Failure phenomenon: 3D point cloud data abnormality

Diagnostic steps:

Check the laser power supply voltage (24V±0.5V)

Verify the calibration board measurement value

Check ambient light interference

Emergency measures:

Temporarily enable 2D detection mode

Adjust laser power (80-120% range)

V. Advanced application skills

1. Optimization of special material detection

Ceramic substrate: Enable infrared band detection (optional IR module required)

Flexible PCB: Use segmented scanning mode (reduce mechanical stress)

2. Improve detection efficiency

Parallel processing technology:

Optimization example

Traditional mode: Sequential detection → 0.5 seconds/point

Optimization mode: Regional parallel → 0.2 seconds/point

Intelligent skip inspection strategy: automatically reduce the inspection density for the tested qualified areas

VI. Technical support system

Remote diagnosis: support VPN real-time connection (requires advance filing)

Spare parts replacement cycle:

Laser: ≥20,000 hours

Industrial camera: ≥50,000 hours

Calibration service: It is recommended to calibrate the original factory once a year